Toshiba Announces New Highly-Sensitive CMOS Image Sensor With Back-Side Illumination Technology

July 7, 2011

New Image Sensor Supports High Image Resolution in Small Form Factor; Targets Portable Digital Applications

Toshiba CMOS Image Sensor With Back-Side Illumination Technology

SAN JOSE, Calif., — Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced the launch of a new CMOS image sensor that offers the industry’s smallest pixel size (1.12 micrometers)1 with enhanced sensitivity and improved imaging performance through the use of back-side illumination technology (BSI). Thanks to their ability to conform to tight form factors and still capture high-definition images, Toshiba expects BSI CMOS image sensors to become a mainstream technology in a variety of portable digital devices, ranging from mobile phones and digital cameras to smartphones and tablets.

"As smartphones and other portable digital devices move to smaller form factors, image sensors must also shrink in size. This presents imaging subsystem designers with a challenge: how do you get smaller and smaller image sensors to support higher image resolutions when miniaturization can cause a fall off in performance?" said Andrew Burt, vice president, Analog and Imaging Business Unit, System LSI Group, TAEC. "Our BSI technology overcomes this problem by deploying the lens on the rear of the sensor, on its silicon substrate, not on the front, where wiring limits light absorption. This positioning boosts light sensitivity and absorption, and allows Toshiba to make finer quality image pixels in smaller-sized CMOS image sensors. This increased sensitivity also makes our BSI CMOS image sensors more suitable for video applications, such as video capture or video chat."

The first product in Toshiba’s new line of BSI CMOS image sensors will feature a .25-inch optical format and 8 Megapixels, with each pixel measuring only 1.12 micrometers. The sensor will support video capture at up to 60 frames-per-second in both 1080p and 720p high-definition.

Pricing and Availability

Sampling of the new sensor, part number T4K05, will begin at the end of this month with mass production scheduled to begin in late 2011. Samples are priced at $15 per unit.

*About Toshiba Corp. and TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributions and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, imaging products, microcontrollers and wireless components that make possible today’s leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan’s largest semiconductor manufacturer and the world’s third largest semiconductor manufacturer (Gartner, 2010 WW Semiconductor Revenue, April 2011). Toshiba was founded in 1875, and today operates a global network of more than 490 companies, with 203,000 employees worldwide and annual sales of $77 billion. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.

1As of 7/7/2011


Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba’s “Handling Guide for Semiconductor Devices,” or "Toshiba Semiconductor Reliability Handbook."” This information is available at www.chips.toshiba.com, or from your TAEC representative.

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