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HZIP25

In developing your designs, please ensure the datasheet.

HZIP25package
Mounting Through Hole
Pins 25
Package Dimensions (mm)
Package HZIP25-P-1.00F
Thermal resistance (℃/W) 36.4
Packing Method Tube Packaging
Minimum Quantity 17 pcs/Tube
Tube Dimensions (mm)
Semiconductor Package
Mount Manual
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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.