Microcontroller

Clicking on product's category allows you to see Microcontroller Part Naming Conventions.

Example 1) TMP89FS60xxUG

Example 1 of Microcontroller
Example 1 of Microcontroller

1. Toshiba microcontrollers

2. Microcontroller core
 89: 870/C1  92: 900/H1

3. ROM type
 C: Mask  E: EEPROM  F: Flash  P: OTP

4. ROM size

  1 2 3 4 6 8 C H K M N P S U W F Y Z D
KB 1 2 3 4 6 8 12 16 24 32 40 48 60/64 96 124/128 192 256 384 512

5. Microcontroller subtype

6. Microcontroller revision

7. Automotive quality grade
 R: Grade A, -40°C to +85°C T: Grade A, -40°C to +125°C
 I: Grade B, -40°C to +85°C S: Grade B, -40°C to +125°C

8. Package
 QG: Plastic shrink quad outline non-leaded package (VQON); dry-packed
 XBG: Plastic ball grid array (BGA); dry-packed
 WBG: Wafer-level chip size package (WCSP); dry-packed
 UG, DUG, FG, DFG: Plastic quad flat package (QFP); dry-packed
 MG, DMG: Plastic small-outline package (SOP); dry-packed
 NG: Plastic shrink dual-in-line package (SDIP)

Example 2) TMPM369FDxxXBG

Example 2 of Microcontroller
Example 2 of Microcontroller

1. Toshiba microcontrollers

2. Microcontroller core
 M0: 00  M3: 03  M4: 04  R4: 04R  A9: 09  19A: 19A, 19A/H1

3. Microcontroller subtype

4. ROM type
 C: Mask  F: Flash

5. ROM size

  H M R S W Y Z D E 10 15 20
KB 16 32 56 64 128 256 384 512 768 1024 1536 2048

6. Microcontroller revision

7. Automotive quality grade
 R: Grade A, -40°C to +85°C T: Grade A, -40°C to +125°C
 I: Grade B, -40°C to +85°C S: Grade B, -40°C to +125°C

8. Package
 QG: Plastic shrink quad outline non-leaded package (VQON); dry-packed
 XBG: Plastic ball grid array (BGA, FBGA, TFBGA, VFBGA); dry-packed
 UG, FG, DFG: Plastic quad flat package (QFP, LQFP, HQFP); dry-packed
 DMG: Plastic small-outline package (SOP); dry-packed
 NG: Plastic shrink dual-in-line package (SDIP)

Example 3) TMPM3H4FWxUG

Example 3 of Microcontroller
Example 3 of Microcontroller

1. The identification of Toshiba microcontrollers.

2. Core
 M4: ARM Cortex-M4  M3: ARM Cortex-M3  M0: ARM Cortex-M0

3. Product Group
 TXZ family is written in alphabet and TX family is numbers.
 H: For General-purpose/Consumer electronic equipment
 K: For Motor/Inverter control industrial equipment(MCU+AMP/COMP)
 G: For OA/Digital equipment/industrial equipment
 E: For Robotics, precision instruments control
 P: For Healthcare / Battery equipment

4. Pin Count
 Within the same group, numbers and alphabets may be used properly depending on the difference in SPEC even with the same pin count.

  Pin Count
0 G ≤32Pins
1 H 33Pins≤, ≤44Pins
2 J 45Pins≤, ≤48Pins
3 K 49Pins≤, ≤52Pins
4 L 53Pins≤, ≤64Pins
5 M 65Pins≤, ≤80Pins
6 N 81Pins≤, ≤100Pins
7 P 101Pins≤, ≤128Pins
8 Q 129Pins≤, ≤144Pins
9 R 145Pins≤, ≤176Pins
A S 177Pins≤, ≤200Pins
B T 201Pins≤, ≤224Pins
C U 225Pins≤, ≤250Pins
D V 251Pins≤, ≤300Pins

5. ROM type
 F: Flash C: Mask

6. ROM size

  M P S U W Y Z D E 10 15 20 40 80
KB 32 48 64 96 128 256 384 512 768 1024 1536 2048 4096 8192

7. Revision

8. Package
 QG: Plastic shrink quad outline non-leaded package; dry-packed
 UG, DUG, FG, DFG: Plastic quad flat package; dry-packed
 MG, DMG: Plastic small-outline package ; dry-packed
 XBG: Plastic ball grid array ; dry-packed

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