Contact us

A new window will open A new window will open

Buck Power Supplies

Buck power supplies are the most common type of non-insulated DC-DC converters utilized as power sources for mobile devices and CPUs with a capacity in the range of a few watts to more than 100 watts. MOSFETs with high-speed switching performance are used since buck power supplies operate at a higher frequencies than the other types of power supplies. Demand for even higher efficiency is driving a shift to synchronous rectification. Toshiba is expanding the portfolios of its latest UMOS-Ⅷ-H and UMOS-Ⅸ-H series with high-speed switching performance and low on-resistance ideal for buck power supply applications.

Block Diagram

Click on the colored blocks to view recommended products.

Buck型電源の回路例

High-Side MOSFET Low-Side MOSFET

Documents

Whitepaper

Whitepaper
Name Outline Date of issue
Describes the features of the DTMOSV series and the improvements from the previous series 9/2017

user registration

  • DTMOS Applications (Noise Reduction)
Describes the mechanism of noise generation and noise reduction techniques coming soon

Application Note

Application note
Name outline Date of issue
Provides hints and tips based on simulation results to help you reduce the chip temperature of discrete semiconductor devices. 01/2018
The high dv / dt between the drain and the source of the MOSFET can cause problems and explain the cause of this phenomenon and its countermeasures. 12/2017
Describes mechanism of avalanche phenomenon, I will explain durability and countermeasures against it 12/2017
describes how to reduce the chip temperature of discrete semiconductor devices. 12/2017
describes how to calculate the temperature of discrete semiconductor devices. 12/2017
discusses temperature derating of the MOSFET safe operating area. 12/2017
When a rapidly rising voltage is applied between the drain and source of the MOSFET,the MOSFET may malfunction and turn on, and its mechanism and countermeasures will be explained. 12/2017
Describes the guidelines for the design of a gate driver circuit for MOSFET switching applications and presents examples of gate driver circuits 11/2017

user registration

Describes current imbalance in parallel MOSFETs and the mechanism of parasitic oscillation 11/2017

user registration

Describes the oscillation mechanism of MOSFETs for switching applications 11/2017

user registration

Describes thermal equivalent circuits, examples of channel temperature calculation and considerations for heatsink attachment 2/2017
Describes planar, trench and super-junction power MOSFETs 11/2016
Describes the absolute maximum ratings, thermal impedance and safe operating area of power MOSFETs 11/2016
Describes electrical characteristics shown in datasheets 11/2016
Describes how to select power MOSFETs, temperature characteristics, the impacts of wires and parasitic oscillation, avalanche ruggedness, snubber circuits and so on 11/2016

Video


Contacts

If you have any questions, click one of these links:

Technical queries
Questions about purchasing, sampling and IC reliability
To Top
·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.