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Lineup of SO6L(LF4) package IC output photocoupler is expanded: TLP2710(LF4), etc.

Product News 2018-04

The package photograph of lineup of SO6L(LF4) package IC output photocoupler is expanded: TLP2710(LF4), etc.

The six new products, including TLP2710(LF4), which expand our lineup of SO6L(LF4) package products are wide-lead spacing[1] options of our SO6L package IC output photocouplers.
The eight existing SO6L(LF4) products in the lineup comprise three for high speed communication and five for driving IGBT/MOSFETs. The six new products are newly available in the lineup comprise an additional three for high speed communication and three for driving IGBT/MOSFETs. The new package replaces our SDIP6(F type), and they are compatible in mounting.
In addition, the maximum mounting height is 2.3 mm, making the new package about 45 % lower height than the SDIP6(F type). These products can therefore be used where height is limited, such as on the back side of circuit boards, contributing to smaller equipment.

Notes:
[1] Wider lead bend package than standard package

Features

  • Lineup of SO6L(LF4) package is expanded
  • Thin package: height 2.3 mm (max)
    [Comparison with SDIP6(F type), height can be lower to about 45 %, and it is compatibility in mounting]
  • High operating temperature rating

Applications

  • High-speed communications
    (Factory networking, digital interfacing, I/O interface boards, programmable logic controllers and Intelligent power module drive[2], etc.)
  • IGBT/MOSFET drivers
    (Industrial inverters, air conditioner inverters and inverters for photovoltaics, etc.)

Notes:
[2] TLP2710(LF4), TLP2745(LF4), TLP2748(LF4)

Product Specifications

(Unless otherwise specified, @Ta=Topr)

Part number Applications Package Absolute maximum ratings Supply
current
ICCH, ICCL
max
(mA)
Threshold
input
current
(L→H)
IFLH
max
(mA)
Propagation
delay time
tpLH, tpHL
max
(ns)
Common
-mode
transient
immunity
CMH, CML
min
@Ta=25 °C
(kV/μs)
Isolation
voltage
BVS
min
@Ta=25 °C
(Vrms)
Name Height
max
(mm)
Operating
temperature
Topr
(°C)
Peak
output
current
IOPH, IOPL
(A)
TLP2710(LF4) For
high-speed
communications

SO6L
(LF4)
2.3 -40 to 125 - 0.3[3] 1.0 250 ±25 5000
TLP2745(LF4) -40 to 110 - 3 1.6 120 ±30 5000
TLP2748(LF4) -40 to 110 - 3 1.6[4] 120 ±30 5000
TLP5771(LF4) For
IGBTs/MOSFETs
drive
-40 to 110 ±1.0 3 2 150 ±35 5000
TLP5772(LF4) -40 to 110 ±2.5 3 2 150 ±35 5000
TLP5774(LF4) -40 to 110 ±4.0 3 2 150 ±35 5000

Notes:
[3] IDDH, IDDL
[4] IFHL

Internal Circuit

The illustration of internal circuit of lineup of SO6L(LF4) package IC output photocoupler is expanded: TLP2710(LF4), etc.

Notes:
[5] VDD for TLP2710(LF4)

Application Circuit Example

The illustration of application circuit example of lineup of SO6L(LF4) package IC output photocoupler is expanded: TLP2710(LF4), etc.

The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass-production design stage. Toshiba Electronic Devices & Storage Corporation does not grant any license to any industrial property rights by providing these examples of application circuits.

Information in this document, including product prices and specifications, content of services and contact information, is correct on the date of the announcement but is subject to change without prior notice.

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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.