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Toshiba’s SO6L Package IC Photocouplers Now Have Option for Wide Leadform

May 17, 2017

New products realize direct replacement from current SDIP6(F type) package products.

SO6L(LF4)

TOKYO–Toshiba Corporation's (TOKYO: 6502) Storage & Electronic Devices Solutions Company is expanding its line-up of SO6L IC photocouplers with a new package type SO6L(LF4), the wide leadform option. The wide leadform option is available for three high-speed IC photocouplers and five IGBT/MOSFET driver photocouplers. Mass production shipments start today.

The new photocouplers are in a SO6L(LF4) package and can be mounted on land patterns of SDIP6(F type) products with a maximum height of 4.15mm. The SO6L(LF4)’s 2.3mm (max) thin package offers users the advantage of directly replacing SDIP6(F type) products in height-critical applications that require lower package height, such as a back of PCBs.

To support replacement of widely used original land pattern of SDIP6(F type) package products, Toshiba will expand the wide leadform option line-up for other SO6L IC photocouplers.

The latest Gartner market report recognizes Toshiba as the leading manufacturer of optocouplers by sales in 2015 and 2016, with 23% of sale-based market share in CY2016. (Source: Gartner “Market Share: Semiconductor Devices and Applications Worldwide 2016” 30 March, 2016)

Toshiba will continue to deliver products that meet the needs of customers by promoting the development of a diverse portfolio of photocouplers and photorelays tailored to market trends.

Applications

High-speed communication photocoupler

  • Factory networking
  • High-speed digital interfacing for instrumentation and control devices
  • I/O interface boards
  • Programmable logic controllers (PLCs)
  • Intelligent power module (IPM) drive *
    *TLP2704(LF4)

IGBT/MOSFET driver photocoupler

  • Industrial inverters
  • Air conditioner inverters
  • Inverters for solar energy

Features

Package height: 2.3mm (max)

1.85mm lower than SDIP6(F type) (reduced 45 %)

Pin distance: 9.35mm (min)

Direct replacement is possible since SDIP6(F type) pin distance is 9.4mm (min)

Main Specifications

(@Ta=25℃)

Part number Package Creepage distance
min
(mm)
BVs
min
 (kVrms)
ICC
max
(mA)
Thresh old input current
max
(mA)
Propagation delay
max
(ns)
Peak output current
max
(A)
CMR
min
(kV/μs)
TLP2704(LF4) SO6L-LF4 8 5 1.3 5 550 - ±20
TLP2761(LF4) 1 1.6 80 - ±20
TLP2768A(LF4) 4 5 60 - ±20
TLP5701(LF4) 2 5 500 0.6 ±20
TLP5702(LF4) 3 5 200 2.5 ±20
TLP5751(LF4) 3 4 150 1 ±35
TLP5752(LF4) 2.5
TLP5754(LF4) 4

Notes

 [1] New products.

Follow the link below for more on the new products and Toshiba’s photocoupler line-up.

https://toshiba.semicon-storage.com/ap-en/product/opto/photocoupler.html

Customer Inquiries:

Optoelectronic Device Sales & Marketing Dept.
Tel: +81-3-3457-3431
https://toshiba.semicon-storage.com/ap-en/contact.html

Information in this document, including product prices and specifications, content of services and contact information, is correct on the date of the announcement but is subject to change without prior notice.

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