June 30, 2017
Storage & Electronic Devices Solutions Company
TOKYO—Toshiba Corporation’s (TOKYO: 6502) Storage & Electronic Devices Solutions Company today announced the launch of “TLP5832,” a new gate driver photocoupler housed in a low-height SO8L package. It delivers 2.5A peak output power and can directly drive medium-class IGBTs. Shipments start today.
Adoption of the SO8L package realizes an IC approximately 54% lower in height than Toshiba’s current products in SDIP6 and DIP8 (LF1 option) packages, providing support for mounting on boards with limited mounting height and also contributing to downsizing of sets. In spite of its small size, the IC secures minimum creepage and a clearance distance of at least 8mm, making it suitable for applications requiring high insulation performance.
On top of this, the new gate driver photocoupler guarantees propagation delay and propagation skew in full operating temperature range between –40deg.C and +110deg.C. High-efficiency design of inverter circuits can be realized by reducing temperature margin.
The latest Gartner market report recognizes Toshiba as the leading manufacturer of optocouplers by sales in 2015 and 2016, with 23% of sale-based market share in CY2016. (Source: Gartner, Inc. "Market Share: Semiconductor Devices and Applications, Worldwide, 2016" 30 March 2017)
Toshiba will continue to deliver products that meet the needs of customers by promoting the development of a diverse portfolio of photocouplers and photorelays tailored to market trends.
(Unless otherwise specified, Ta = -40 to 110℃. All typical values are at Ta = 25℃)
|Recommended Operating Conditions
|Peak low-level output current
IOPH, IOPL max (A)
VCC min/max (V)
|Electrical Characteristics||Supply current
ICCH, ICCL max (mA)
|Threshold input current(L→H)
IFLH max (mA)
|Switching Characteristics||Propagation delay time
tPLH, tPHL max (ns)
|Propagation delay skew
tPsk min/max (ns)
|Common-mode transient immunity
CMH, CML min (kV/μs)
BVS min (Vrms)
|Mechanical Parameters||Clearance distances
|Internal isolation thickness
Optoelectronic Device Sales & Marketing Dept
Information in this document, including product prices and specifications, content of services and contact information, is correct on the date of the announcement but is subject to change without prior notice.