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DIP20-P-300-2.54A

In developing your designs, please ensure the datasheet.

DIP20-P-300-2.54Apackage
Mounting Through Hole
Pins 20
Package Dimensions (mm)
Package DIP20-P-300-2.54A
Thermal resistance (℃/W) -
Packing Method -
Semiconductor Package
Mount Manual
-
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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.