Wireless Communications Equipment ICs
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To address the needs of the rapidly growing market for proximity wireless applications, Toshiba has developed an ultra-small TransferJet™ SDIO module. The smallest possible components are required for space-critical mobile devices such as smartphones. The ultra-small TransferJet™ SDIO module, which embodies Toshiba's radio-frequency (RF) design and hybrid integration technologies, helps save board space. The TJM35420XLQ module contains RF components and a crystal oscillator to simplify the design of TransferJet™ applications.