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TransferJet™-Compliant Wireless Module: TJM35420XLQ

Photo of an ultra-small TransferJet SDIO module

To address the needs of the rapidly growing market for proximity wireless applications, Toshiba has developed an ultra-small TransferJet™ SDIO module. The smallest possible components are required for space-critical mobile devices such as smartphones. The ultra-small TransferJet™ SDIO module, which embodies Toshiba's radio-frequency (RF) design and hybrid integration technologies, helps save board space. The TJM35420XLQ module contains RF components and a crystal oscillator to simplify the design of TransferJet™ applications.

Applications

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Electronic devices such as smartphones, tablets, digital cameras and notebook PCs

Key Features

  • Package: LGA
  • Incorporates the TC35420, a TransferJet™-compliant wireless IC
  • Built-in RF components
  • Built-in X'tal
  • Host interface: SDIO UHS-I support
  • TransferJet™-compliant
  • Outline dimensions: 4.8 (W) × 4.8 (D) × 1.0 (H) (max) (Unit: mm)

SDIO Module Block Diagram

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Transferjet™ -compliant IC Lineup

Contacts

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Technical queries
Questions about purchasing, sampling and IC reliability
·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.