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Lineup of SO6L and SO6L(LF4) package IC output photocoupler is expanded: TLP2719, etc.

Product News 2018-06

The package photograph of lineup of SO6L and SO6L(LF4) package IC output photocoupler is expanded: TLP2719, etc.

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched four IC output photocoupler products, TLP2719 and others, which use either the SO6L or SO6L(LF4)[1] package compatible with our SDIP6 and SDIP6(F type) packages in mounting.
There are six products in our lineup of SO6L(LF4)[1] package products for high speed communication, with two new products.
In addition, the maximum mounting height is 2.3 mm, making the new package about 45 % lower height than the SDIP6 and SDIP6(F type). These products can therefore be used where height is limited, such as on the back side of circuit boards, contributing to smaller equipment.

Notes:
[1] Wider lead bend package than standard package

Features

  • Lineup of SO6L and SO6L(LF4)[1] package is expanded
  • Thin package: height 2.3 mm (max) [Comparison with SDIP6 and SDIP6(F type), height can be lower to about 45 %, and it is compatibility in mounting]
  • High operating temperature rating

Applications

  • High-speed communications for industrial equipment
    (Factory automation networking, digital interfacing, I/O interface boards and programmable logic controllers, etc.)

Product Specifications

(Unless otherwise specified, @Ta=Topr)

Part
number
Package Absolute
maximum
ratings
High-
level
supply
current
ICCH
max
(mA)
Low-
level
supply
current
ICCL
max
(mA)
Threshold
input
current
(H→L)
IFHL
max
(mA)
Current
transfer
ratio
IO/IF
min / max
(%)
Propagation
delay time
tpLH, tpHL
max
(ns)
Common-
mode
transient
immunity
CMH, CML
min
@Ta=25 °C
(kV/μs)
Isolation
voltage
BVS
min
@Ta=25 °C
(Vrms)
Name Height
max
(mm)
Operating
temperature
Topr
(°C)
TLP2719 SO6L 2.3 -40 to 100 0.001 - - 15 / 55 800[2] ±10 5000
TLP2719(LF4) SO6L
(LF4)[1]
TLP2766A SO6L -40 to 125 3 3 3.5 - 40 ±20
TLP2766A(LF4) SO6L
(LF4)[1]

Notes:
[2] @Ta=25 °C

Pin Assignment

The illustration of pin assignment of lineup of SO6L and SO6L(LF4) package IC output photocoupler is expanded: TLP2719, etc.

Application Circuit Example

The illustration of application circuit example of lineup of SO6L and SO6L(LF4) package IC output photocoupler is expanded: TLP2719, etc.

Notes:
[3] IPM (Intelligent Power Module)

The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass-production design stage. Toshiba Electronic Devices & Storage Corporation does not grant any license to any industrial property rights by providing these examples of application circuits.

Information in this document, including product prices and specifications, content of services and contact information, is correct on the date of the announcement but is subject to change without prior notice.

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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.