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车载桥接芯片

As in-vehicle infotainment (IVI) systems, along with other automotive systems, become more sophisticated, requiring greater functionality and higher performance, an interface gap problem between peripheral devices and Systems-on-chip (SoCs) easily arises. Toshiba interface bridge ICs can help to solve this problem.

Automotive Peripheral Bridge IC

SoCs, widely applied in smartphones and tablets, are increasinly appearing in automotive applications as IVI systems become more sophisticated, requiring greater functionality and higher performance. But because connectivity standards differ among devices such as displays, existing SoCs often lack the interfaces required for automotive networks.

Automotive Peripheral Bridge ICs

Necessity of AMPD (Interface Bridge IC)

SoC with only MIPI I/Fs as AV I/F may require AMPDs to connect external devices such as displays and cameras.

Necessity of AMPD (Interface Bridge IC)

Toshiba’s new range of video interface bridge devices provide HDMI to MIPI® CSI-2 (TC9590), MIPI® CSI-2 to/from parallel (TC9591), and MIPI® DSI to LVDS (TC9592/3) connectivity. The devices are offered in 0.65mm pitch, VFBGA packages between 5 x 5 mm and 7 x 7mm, with the exception of the TC9590 which is housed in an LFBGA64, 0.8mm pitch 7 x 7mm package.

Toshiba has a long track record of developing MIPI®-based interface bridge chips for consumer applications and has drawn on this experience in developing the new automotive IVI range.

Sample shipments of the new devices start in June 2018.

A-CPLB A-H2C A-D2L(-LP) A-D2DP
For Automotive TC9591 TC9590 TC9592 TC9593 TC959x
For Consumer TC358748I TC358743I TC358774 TC358775 TC358867
Input
  • MIPI CSI2 RX 4Lanes x 1ch
  • Parallel input 24bit@154MHz
HDMI 1.4a MIPI DSI
4 Lanes x 1ch
MIPI DSI
4 Lanes x 1ch
MIPI DSI
4 Lanes x 1ch./ MIPI DPI (24bit)
Output
  • Parallel output 24bit@100MHz
  • MIPI CSI2-TX
    4Lanes x 1ch

MIPI CSI2-TX 4Data LanesX1ch

LVDS
Single Link 
(5 pairs/ link)

LVDS
Dual Link
(5 pairs/ link)
Display Port
x 2 Ports/
MIPI DPI (24bit)
Resolution - - UXGA 1600x1200
@24bit
WUXGA 1920x1200
@24bit
WUXGA
1920x1200
@24bit
Ta -40 to 105℃ -40 to 85℃ -40 to 85℃ -40 to 85℃ -20 to 85℃
PKG VFBGA80
7mm x 7mm
0.65mm pitch
LFBGA64
7mm x 7mm 0.8mm pitch
VFBGA49
5mm x 5mm 0.65mm pitch
VFBGA64
6mm x 6mm 0.65mm pitch
VFBGA80
7mm x 7mm
0.65mm pitch

*HDMI and the HDMI logo are trademarks or registered trademarks of HDMI Licensing in the U.S and other countries.

*MIPI® mark and logo are registered trademark of MIPI® Alliance, Inc.

TC9560XBG/TC9560AXBG[开发中]/TC9560BXBG[开发中]

汽车应用领域的以太网AVB桥接解决方案

车载信息娱乐系统(IVI)、信息技术与其它汽车子系统的网络接口。

特点
  1. TC9560XBG支持IEEE 802.1AS和IEEE 802.1Qav等通常涉及到以太网AVB的标准。
    TC9560XBG连接至应用处理器或其它SoC主机后,就可以允许主机设备通过汽车内的10/100/1000以太网络传输音频、视频和数据。
  2. 与主机的连接是通过PCIe®,它运行于适合音频流的2.5/5.0GT/s(PCIe Gen1.0/2.0),480Mbps HSIC或TDM(时分多路传输)/I2S。
  3. 提供以太网PHY接口,可以选择RGMII、RMII和MII。
  4. 设计目标是实现低功率模式,即室温下通常消耗0.25mW(由东芝测量)。TC9560XBG通常只需要100ms的时间即可返回至正常操作状态(由东芝测量),这就满足了市场需求。TC9560XBG将计划通过AEC-Q100标准3级资质要求。
系统方框图
  • 举例

これはシステム構成例です。

  • 接口连接举例

これは接続例です。

TC9560 Family Part Number TC9560XBG TC9560AXBG** TC9560BXBG**
Package PLFBGA170 (0.65)
Applications Ethernet AVB Bridge Solution For Automotive Applications
Functions
and
Features
Host (External application) I/F: -
  • PCIe I/F [Gen2.0 (5 GT/s), Gen1.0 (2.5 GT/s), Endpoint, Single lane]
  • HSIC I/F (480 Mbps)
- -
Automotive I/F:
  • Ethernet AVB [IEEE802.1AS, IEEE 802.1Qav].
    The interface is selectable from RGMII, RMII and MII, MAC
  • CAN-FD (2 ch)
- -
Audio I/F: I2S/TDM
Peripheral I/F: I2C/SPI, Quad-SPI, UART, GPIO, INTC
CPU Core: Arm®Cortex®-M3
Supply Voltage (V) 1.8/3.3 for IO, 1.2 for HSIC, 1.2/2.5/3.3 for RGMII/RMII/MII, 1.1 for Core

**:开发中

*Arm和Cortex是Arm有限公司(或其子公司)在美国和其它国家的注册商标。

*PCI Express和PCIe是PCI-SIG的注册商标。

*本文提及到的系统和产品名称可能是各自公司或组织的商标或注册商标。

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