TC35667IFTG-006

停产产品

Bluetooth® IC

产品概要

Feature Automotive / LE single / Scatternet support / Standalone mode support
Automotive Support Available
Bluetooth Category Bluetooth® low energy
Bluetooth Core spec. 4.1
Embedded Profiles GATT / SMP
Interfacing I2C / SPI / UART / PWM / ADC
User RAM Size (KB) 32
User Flash Size (KB)
Function ARM® ARM7TDMI-S™ / RF analog circuitry / DC-DC converter / low power mode(4 level)
Other Functions Scatternet
RoHS Compatible Product(s) (#) Please contact us.
Status Not recommended for new design

封装

Toshiba Package Name P-VQFN40-0606-0.50-001
Package Image P-VQFN40-0606-0.50-001
Package name QFN
Pins 40
Mounting Surface Mount
Package size 6.0 mm x 6.0 mm
Pin pitch 0.5 mm
Package Dimensions 查看
Land pattern dimensions 查看

 Please refer to the link destination to check the detailed size.

电气特性

项目 符号 条件 单位
Operating Temperature (Max) Topr - 85
Operating Temperature (Min) Topr - -40
Power supply voltage (Max) - - 3.6 V
Power supply voltage (Min) - - 1.8 V
Current Consumption in RX Active mode (peak) IRX (3.0V) 6.3 mA
Current Consumption in TX Active mode (peak) ITX (3.0V, TX -4dBm) 6.3 mA
Current Consumption in Sleep mode ISleep - 10 μA
Current Consumption in Deep Sleep mode IDSleep - 0.05 μA
Transmit Power(Max) PTrans - 0 dBm
Receiver Sensitivity - - -92 dBm

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常见问题

常见问题(FAQ)

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