Contact us

Es wird ein neues Fenster geöffnet Es wird ein neues Fenster geöffnet

DSOP-Advance-Gehäuse mit doppelseitiger Kühlung: Höhere Wärmeleitfähigkeit bei Leistungs-MOSFETs

Dieses Whitepaper beschreibt die Leistungsfähigkeit eines neuen Gehäuses. Es wurde auf der PCIM 2015 von Georges Tchouangue, Chief Engineer Discrete Marketing – Power Semiconductors bei Toshiba Electronics Europe vorgestellt. Das neue Gehäuse verspricht einen um 26% geringeren Wärmewiderstand (Rth) und einen um 25% geringeren elektrischen Gehäusewiderstand.
 

Im Download des Whitepapers erfahren Sie, wie DSOP-Advance-Gehäuse die Wärmeleitfähigkeit verbessern und den elektrischen Gehäusewiderstand verringern:
 

  • Gehäuseaufbau
  • Wärmewiderstand
  • Elektrische Eigenschaften

Simply fill out the form below to request your free whitepaper:

Request the Whitepaper



To improve the user experience on our website, we are analyzing your visit e.g by using your full IP-address. By submitting the form you formally agree to this. You have the right to revoke your consent at any time by setting an opt-out cookie for the Marketo-Service as described in our privacy policy: https://toshiba.semicon-storage.com/eu/corporate/tee/privacy-policy.html





We respect the privacy and security of your personal data wherever we provide our services and products. Therefore, through technical and organizational measures, we have ensured that personal data of Russian citizens will not be stored, used and forwarded outside of the Russian territory. As a consequence, we are regrettably not able to offer all of the Website services (such as newsletters, for example) to Russian citizens.


To Top
·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.