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DSOP-Advance-Gehäuse mit doppelseitiger Kühlung: Höhere Wärmeleitfähigkeit bei Leistungs-MOSFETs

Dieses Whitepaper beschreibt die Leistungsfähigkeit eines neuen Gehäuses. Es wurde auf der PCIM 2015 von Georges Tchouangue, Chief Engineer Discrete Marketing – Power Semiconductors bei Toshiba Electronics Europe vorgestellt. Das neue Gehäuse verspricht einen um 26% geringeren Wärmewiderstand (Rth) und einen um 25% geringeren elektrischen Gehäusewiderstand.

Im Download des Whitepapers erfahren Sie, wie DSOP-Advance-Gehäuse die Wärmeleitfähigkeit verbessern und den elektrischen Gehäusewiderstand verringern:

  • Gehäuseaufbau
  • Wärmewiderstand
  • Elektrische Eigenschaften

Simply fill out the form below to request your free whitepaper:

Request the Whitepaper

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