PCIM 2023

UPDATED
Passion for Power Solutions

PCIM 2023 ended. Thank you for making the fair a big success for us. For decades we at Toshiba Electronics Europe GmbH (TEE) have lived up to the challenge of developing effective power solutions. We invite you to discuss the latest industry power design trends even further. Contact your local sales person or drop as an email. 

Do you want to know a little bit more about our fair highlights? Watch our longer booth introduction video.

Exhibits at PCIM

 

Digital Isolators

Toshiba Standard Digital Isolators have low pulse distortion and high CMTI, which are required for isolation of high-speed signaling, and are applicable to a wide range of consumer and industrial applications.  In particular, the isolation transformer circuit offers high CMTI by adopting the magnetic coupling method developed by Toshiba.

 

SiC-CUBE Proof-of-Concept 

Developed at the High Voltage Lab in Duesseldorf, Germany, the SiC-CUBE proof-of-concept simplifies power system implementation by using a modular approach. The SiC-CUBE has a compact 140mm x 140mm x 210mm 3D form factor (which is then attached to a heatsink) achieving a high power density. Thanks to the 3-level half-bridge configuration, the voltage swing across each MOSFET can be reduced, that the power losses experienced are minimized. It allows the usage of 650V-rated MOSFETs, rather than ones with 1200V ratings, presenting a more cost-effective modular way of implementing a PFC. The SiC-Cube is addressing off-board charger and renewable energy generation applications.

Learn more at our booth 9 -503 in May! Any questions in advance? 

 

Multi-Axis Robot Arm Demonstration

Experience how a robot arm moves smoothly, because a single MCU controls 3 motors. Within the model Toshiba`s motor control MCUs work effectively together with Toshiba’s low RDS(ON) power MOSFETs. Hence precise and accurate movement of the robot arm is achieved. Key products incorporated are Toshiba`s TMPM4KNFYADFG Motor MCU (160MHz), the Low-Voltage MOSFET TPW3R70APL (U-MOS IX Serie), the photocoupler TLP2370, the Low Dropout (LDO) Linear Voltage Regulator TCR3DM33 and the Dual-supply level shift bus switchTC7QPB9307FK. The fluid design can be used for industrial applications.

Learn more at our booth 9 -503 in May! Any question in advance?

 

3-Phase Multi-Level Inverter Using MOSFET

This reference design provides a design guide, data and other contents of the 3-Phase Multi-Level Inverter with 5 level output. It uses 150 V MOSFETs to drive a 200 V Motor. 

Learn more at our booth 9 -503 in May! Any question in advance?

 

USB Power Supply Reference Design Using Automotive MOSFETs

We introduce a USB power supply demo set equipped with Toshiba´s high-efficiency MOSFETs. It is a buck-boost converter equipped with three types of MOSFETs and achieves an efficiency of over 95% at 45 W output.

 

Learn more at our booth 9 -503 in May! Any question in advance?

SCiB Batteries from Toshiba

 

Batteries for Heavy-Duty

The SCiB™ rechargeable battery provides a long life of over 20,000* charge/discharge cycles, rapid charging, high input/output performance, excellent low-temperature performance, and wide SOC range, all while maintaining a high level of safety for applications like trains and other heavy duty applications.

Learn more at our booth 9 -503 in May! Any questions in advance? 

SiN-Substrates for E-Mobility

 

SiN-Substrates for E-Mobility

Toshiba Materials' silicon nitride ceramic substrates have both heat dissipation and strength. They are used in electronics fields such as power semiconductor modules, inverters and converters, replacing other insulating materials to increase production output and reduce size and weight.

Learn more at our booth 9 -503 in May or visit Toshiba Materials booth at hall 7- 503. Any questions in advance? 

Our Speakers at PCIM

Multi-Level SiC Power Design for PFC and DC/DC Conversion 

Tuesday, May 9th | 12:30 | Hall 9 – 551 | Exhibitor Stage

Speaker: Dr. Matthias Ortmann, Toshiba Electronics Europe GmbH

 

Development of Ag-Free Active Metal Brazing Filler for Manufacturing Copper-Si3N4 Substrates

Tuesday, May 9th | 14:20 | Room München 2 | Session "System reliability” 

Speaker: Yoichiro Mori, Toshiba Materials, Japan 

 

Finalist of  PCIM´s Best Paper Award 

Current Adjustable Gate Drive IC with Propagation Delay Reduction Technique for High-Speed Power Transistors 

Tuesday, May 9th | 15:05 | Room Brüssel 1 | Session "Gate drivers" 

Speaker: Hideaki Majima, Toshiba Electronic Devices & Storage, Japan    

 

A Novel 2200 V Schottky Barrier Diode-Embedded SiC MOSFET Module 

Thursday, May 11th | 10:30 | Room Brüssel 1 | Session "SiC Device Design"

Speakers: Takahiro Ogata, Researching and Developing,  Toshiba Electronic Devices & Storage, Japan (Co-Authors: Hiroshi Kono, Saho Fujii, Tanaka Tsuguhiro, Hiroyuki Irifune, Toshiba Electronic Devices & Storage, Japan; Georges Tchouangue, Toshiba Electronics Europe, Germany) 

 

Mixed-Signal Gate Drive IC and Control Schemes for Modern Power Semiconductor Devices

Thursday, May 11th | 13:45 | Hall 7 – 480 | Industrial Stage 

Speaker: Kohei Onizuka & Jenny Feng, Bristol Research and Innovation Lab, Toshiba Europe, UK 

 

Campaigns

Passion for Power Solutions

Picture showing semiconducor board and MOSFET circuit

High efficiency power conversion & control

Interested in more power topics? Our Passion for Power Solutions Page ties it neatly up for you, providing indepth information about our latest product & solution portfolio.

Journey of Motor Control

Integrated solutions for Motor Control

Motors drive the world - from industrial pumps and fans to printers and coffee machines. Get familiar with our Brushed, Brushless and Stepper Motors and learn how to make your motor smarter.   

Videos

More Power Content

High Voltage Laboratory

A high voltage laboratory has been installed at TEE in Düsseldorf which allows us to address  application-related questions from customers more rapidly in the EMEA region.

 

Power Focus Interview

Learn more about TEE’s focus on power in Armin Derpmanns’ (General Manager Solution Marketing) interview* with the German Magazine Markt & Technik

*Please note that the interview is in German..

Podcast Analog ICs

The sky is the limit for miniaturization

In the EBV-podcast Passion for technology TEE's General Manager for Solution Marketing Armin Derpmanns discusses the need for miniaturisation of analog devices.

A new window will open