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Meeting the Expectations of Modern Automotive Design through Next Generation Power ICs

Meeting the Expectations of Modern Automotive Design through Next Generation Power ICs

With more stringent international legislature being put in place to curb the impact that automobiles have on the environment, vehicle manufacturers need to find ways of making the numerous subsystems within their latest models lighter and more power efficient. Through this it will be possible to increase the levels of fuel economy, as well as lowering carbon emissions, while at the same time allowing new features and functionality to be introduced that will appeal to car buyers. The industry is progressively replacing mechanical systems with electrically based ones, so that weight can be reduced. Furthermore the electrification of automobiles is now becoming commonplace - with the hybrid/electric vehicle (HEV) sector growing.

If the power semiconductor devices incorporated into automobile designs are to keep pace with the ever increasing demands being exacted upon them, they will need to possess significant advances, both in terms of the process technology employed and the packaging in which they are housed. Among the key performance criteria that need to be fully addressed are:

  • Low on resistance (RDS(ON)) in respect to the die area - so as to minimise power losses
  • Low capacitance
  • Gate charge
  • Support for high switching speeds - in order to improve power efficiency levels
  • Sophisticated thermal management mechanisms - to maximise heat dissipation and reduce thermal resistance 
  • High reliability conditions - including a wide operational temperature range, high current ratings and elevated breakdown voltages
  • Compact dimensions

To learn about the many innovations that Toshiba is making in power semiconductor technology which is targeted at automotive designs click here.

Click here to read more about advances in automotive power

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