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Automotive power: How MOSFET packaging can help solve vehicle electrification challenges

Automotive power: How MOSFET packaging can help solve vehicle electrification challenges

Semiconductor package performance improvements increase reliability as well as enabling higher peak-current ratings and greater current density for high-power applications. Traditional power MOSFET package current-carrying capabilities are limited by the internal wirebonds. These generate heat and are a common point of failure. To address this Toshiba have developed a revolutionary copper clip structure for MOSFET packages, enabling automotive systems that deliver greater performance while managing the associated thermal issues.

The latest DPAK+ package is externally compatible with the familiar DPAK (TO-252) package. However, bondwires typically used to connect the package leadframe to the gate and source metallisation on the die are replaced with copper clips. These have a large contact area and are attached directly to the chip metallisation. This reduces the electrical resistance of the package.. The increase in cross-sectional area enables current-carrying capability to increase without significant heat generation.

TCM0155_Package

In fact, the resistance of a DPAK+ is reduced by 73% when compared to a conventional DPAK package. Copper-clip technology is also featured in Toshiba’s TO-220SM(W) power package. This package is comparable to the conventional D2PAK (TO-263) outline and has a source pin more than three times as wide. The result is that it offers an increased current capability up to 200A within a smaller overall footprint.

Evaluating and implementing these technologies is simplified by a range of Toshiba evaluation boards that demonstrate the technology. To see how Toshiba's latest MOSFET packaging technology can help you take your power designs to the next level, please click here:

Click here to read more about advances in automotive power

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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.