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Features of the Toshiba Intelligent Power Devices (IPDs) Toshiba meets a wide range of customer needs with its original SOI process and DIP26 package

Single-chip IPDs fabricated with an SOI process that integrate output elements and a control circuit on a single chip

Customer requirements for IPDs are broadly divided into two categories. One category targets low-end air conditioners and requires a balance between price and efficiency. The other needs IPDs with even lower power consumption and reduced acoustic noise and vibration for high-end air conditioner applications. As motors become smaller, the needs for smaller IPDs are also growing.
To meet these customer needs, Toshiba has developed a unique process called Silicon-On-Insulator (SOI) that builds semiconductor elements on top of an insulating layer. SOI uses a trench isolation structure in order to prevent latchup problems that could occur during the PN junction isolation process. Toshiba offers small IPDs that combine the output stage consisting of low-loss IGBTs and fast recovery diodes (FRDs) with a control circuit and various protection features (overcurrent, undervoltage and overtemperature).

Toshiba's SOI Technology

Toshiba has developed high-voltage IPDs that incorporate six IGBTs, six FRDs and a control circuit on a single chip, using a unique high-voltage SOI process.

SIO stands for Silicon-On-Insulator. The SOI process involves building semiconductor elements on an insulating layer.

Controllable via an MCU for variable-speed control of a DC motor

The TPD4142K, which is designed primarily for low-end air conditioner applications, incorporates a PWM circuit, a three-phase distribution circuit, level-shift high-side drivers, low-side drivers, various protection features, IGBTs and FRDs. It takes input signals from Hall sensors or a Hall IC and operates as controlled by an MCU. It drives a motor with a square wave, which is commonly used for low-end air conditioner applications, to realize low power consumption at low costs. For high-end air conditioner applications, Toshiba proposes a combination of the TPD4144AK with either a motor control MCU or a motor driver IC in order to drive a motor with a sine wave to reduce power consumption, acoustic noise and vibration. As described above, Toshiba is well positioned to offer not only IPDs alone but also total solutions that combine MCUs, motor driver ICs and/or IPDs.

120-Degree and 180-Degree Commutation

120-Degree (Sine-Wave) Commutation
180-Degree (Sine-Wave) Commutation

DIP26 package ideal for small DC brushless motor applications

Furthermore, Toshiba has developed the DIP26 package optimized for small brushless DC motor applications. DIP26 is physically small and thin and has low on-resistance. With high-voltage/high-current and control pins on the opposite sides of the package, DIP26 eases board design.
IPDs in the DIP26 package are available with a VBB of 100 V to 240 V and an IOUT of 1 A to 3 A, all with an identical pin assignment. Therefore, you can reuse the same board design for various motors just by replacing the IPD.

Toshiba's DIP26 Package

Toshiba's original DIP26 package is physically small, has low on-resistance and eases board design. It is specifically designed for small BLDC motor applications such as air-conditioner fans.

Releasing new IPDs in anticipation of future trends

Home appliances will continue to face demanding challenges in terms of power consumption, acoustic noise and vibration. To help customers address these challenges, Toshiba is further improving its process and circuit technologies to develop IPDs with lower loss and higher performance, as well as new IPDs that reflect customer needs.
Additionally, Toshiba is paying attention to the global markets of air purifiers, washing machines, pumps, ceiling fans, etc. to be ready to offer IPDs that best suit individual applications.

Line-up of IPDs

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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.