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Bluetooth® -Compliant ICs

Bluetooth® Smart Ready and Bluetooth® Smart ICs

Bluetooth® Smart Ready and Bluetooth® Smart, new extensions of Bluetooth, are widely used by mobile, wearable and healthcare devices and their peers for short-distance wireless communication. These devices will become increasingly pervasive in the years ahead. Toshiba has been serving as a Bluetooth SIG*1 promoter for over ten years, contributing to the wider uptake of Bluetooth solutions. Toshiba has offered not only Bluetooth-compliant ICs but also original Bluetooth communication protocols and profiles.

*1 Bluetooth Special Interest Group, the body that oversees the development of Bluetooth standards

TC35661IDBG/ISBG


  • Bluetooth® Smart Ready compliant
  • Incorporates Bluetooth® profiles
  • Reliable interoperability
  • Suitable for low-cost, small-footprint applications
  • Supports all GATT services
  • Reference design available
  • Automotive grade (IDBG: AEC-Q100)

This figure shows the application example: the IC works with host CPU

TC35667IFTG (under development)


  • Bluetooth® Smart compliant
  • Low-power control using a combination of Toshiba-original circuit and firmware
  • Has the capability to execute user application software
  • Various sleep modes
  • Supports all GATT services
  • Suitable for low-cost single-chip (standalone) applications
  • Reference design available
  • Automotive grade (scheduled for AEC-Q100 qualification)

This figure shows the application example: the IC works stand-alone

TC35668IXBG (scheduled MP in July)


  • Bluetooth® Smart Ready compliant
  • System control core: ARM® Cortex®-M3
  • Bluetooth® core: ARM7TDMI-S™
  • DSP core: CEVA® TeakLite-III™
  • Various external interfaces
    SPI ROM interface
    3-channel audio interface
    I2S interface
  • Wireless LAN coexistence
  • Small package P-VFBGA97 pin (6 mm x 6 mm)
  • Automotive grade (scheduled for AEC-Q100 qualification)

This figure shows the application example: the IC works with host CPU

TC35661IDBG / ISBG TC35667IFTG
(under development)
TC35668IXBG
(scheduled MP in July)
-007 -203 -501
Bluetooth® version v4.0 v3.0 v4.0 v4.0
Embedded profiles - (HCI) SPP SPP,GATT GATT HPF, A2DP, AVRCP, PBAP, SPP etc.
Supply voltage 1.8 V or 3.3 V 2.7 V to 3.6 V 2.7 V to 3.6 V
Current consumption in RX/TX active mode (peak) 63 mA 5.9 mA
(3.3 V,TX-4 dBm)
(TBD)
Current consumption in deep sleep mode 30 μA 0.1 μA (TBD)
Transmit power 2 dBm -20 to 0 dBm
(4 dBm steps)
2 dBm
Receiver sensitivity -90 dBm -92 dBm -93 dBm (EDR 2M)
-94.5 dBm (BLE)
Operating temperature -40 to +85 ℃
Package IDBG: BGA64
(7 mm x 7 mm)
ISBG: BGA64
(5 mm x 5 mm)
QFN40
(6 mm x 6 mm)
P-VFBGA97
(6 mm x 6 mm)
Interface UART, I2C, SPI, I2S, PCM UART, I2C, SPI UART, I2C, SPI, I2S, PCM
Functional blocks / functions ARM® core, RF analog circuitry, CVSD codec, host wake-up, wireless LAN coexistence, sleep mode ARM® core, RF analog circuitry, DC-DC converter, ADC, 32-KB user RAM, 4-level sleep mode ARM® core, RF analog circuitry, LDO, various codecs (CVSD, mSBC, SBC, etc.), wireless LAN coexistence, sleep mode
Deliverables Datasheet, command specification, application notes, programming guide, evaluation sample board, reference design (BOM, circuit drawings, layout, sample source code)

* Bluetooth SIG owns the registered trademark, Toshiba uses it under license.

* ARM is a registered trademark of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. ARM7 is a trademark of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. All rights reserved.

* CEVA, the CEVA logo and TeakLite are trademarks or registered trademarks of CEVA, Inc.

* System and product names mentioned herein may be trademarks or registered trademarks of respective companies or organizations.

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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.