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If you opt for raw NAND(NAND Flash Memory) chips, ECC(Error Correction Code), bad-block management, logical-to-physical address conversion, wear leveling (a technique for distributing re-writes evenly across a memory array) and other control functions must be implemented on the host side. With evolving NAND manufacturing processes, ECC is becoming notably more sophisticated, imposing heavier burdens on the host processor, especially for large-capacity NAND.
In response to customer needs, Toshiba offers NAND Flash Memories that integrate a controller in the same package. These are Toshiba’s recommendation for high-capacity NAND Flash Memories.
Toshiba offers e ·MMC™ and UFS, a family of high-capacity NAND Flash Memories that integrates a controller in one package. These NAND
solutions provide ECC and other control functions, optimized by Toshiba for each NAND technology generation.
e ·MMC™ and UFS reduce the workload on the host processor, simplify product development, shorten time-to-market and increase ease of use of memory products.