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●Application note
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Bluetooth® Single-Chip Controller for BT Classic (3.0+EDR) and Bluetooth Low Energy (4.0, 4.2)


The TC35661 series are highly integrated RFCMOS Bluetooth devices which support Bluetooth Classic (3.0+EDR) and Bluetooth Low Energy (LE) 4.0 and 4.2 standards. TC35661 supports the standard Bluetooth HCI interface and offers integration of stack and selected BT profiles on-chip.  Through its WIFI coexistence interface it supports the BT3.0-HS function.  The devices realise an easy way to integrate Bluetooth for various industrial, medical and automotive applications.  Toshiba has tested the Bluetooth interoperability extensively.  All Toshiba Bluetooth devices and software are Bluetooth Qualification Expert (BQE) qualified.

Toshiba Bluetooth® Silicon and Software Brochure (pdf 4.9MB)

Bluetooth Module with TC35661 Bluetooth LSI available

The Toshiba Bluetooth® LSI TC35661SBG has been embedded - including it's SPP & BLE-GATT profile - into the Panasonic (PIDEU) module PAN1026. It is FCC/IC/CE certified.  The embedded stack and profile were Bluetooth™  SIG approved through extensive BQB (Bluetooth™ Qualification Body) tests.  The module is ideal for for wireless serial applications and all kind of BLE connectivity.  System developers can make use of the Serial Port Profile and hook on their selected BLE profile onto BLE-GATT through the comfortable Toshiba API interface over UART.  Read more... (pdf)

TC35661 (FBGA64) Block Diagram

TC35661SBG Block Diagram

Key Benefits

  • Dual Mode core for classic and Bluetooth 4.0 and 4.2 standards
  • BQE qualified hardware and software for easy Bluetooth EPL
  • Flexible system architectures through:
    HCI model
    Embedded profile model
    Stand alone model
  • Embedded on-chip Bluetooth stack and selected profiles for easy Bluetooth system design
  • Stand alone operation for small applications is feasible without a host MCU
  • Ultra low bill of materials due to very few external components
  • Multiple programmable IO options
  • On-chip voltage controller and low power modes
  • Consumer and automotive qualification  (AEC-Q100)

TC35661 Line-up


System Configuration

Product ID(*)

BT 4.0 HCI standard incl. WideBandSpeech



BT 4.0 Embedded Profile

BT 4.2 Embedded Profile

SPP (with EDR)

TC35661-203 (4.2 group)


TC35661-501 (4.0 group)


RC35661-503 (4.2 group)


TC35661-600 (4.0 group)

SPP+BLE GATT with Secure connection

TC35661-551 (4.2 group)

BT 4.0 Stand Alone With Embedded Profile

SPP Stand Alone


HID Stand Alone



  • Bluetooth® Core Spec 3.0, 4.0 and 4.2, EDR and LE support
  • TC35661–0XX: HCI type
  • TC35661–XXX: embedded profile type
  • BT Class 2 support
  • RX Sensitivity –91dBm (typ.)
  • Baseband with ARM® CPU - 13 to 52 MHz
  • On–chip ROM, RAM, including Patch–RAM
  • On–chip balun, antenna switch, LNA, LDO
  • Interfaces: UART, SPI, USB2.0(FS), I2C, I2S/PCM, GPIO
  • IEEE802.15.2. 2/3/4 coexistence interface
  • Data transfer up to 2 Mbps (DH5 packets) net
  • Package: 64ball BGA (ROM version), 0.5/0.8mm pitch, 1.2/1.4mm height
  • Operational voltage: 1.8V  or 3.3V (typ.)
  • Low power sleep mode 30uA (max)
  • Operation mode well below 30mA (depends on packet-type and selected operational mode)
  • AEC-Q100 automotive qualification on selected devices (0.8mm pitch)

TC35661 HCI System Concept


The Bluetooth® HCI (host controller interface) model: the low layer stack (RF, LC, LM) runs on the TC35661SBG device (ROM or external flash memory).  Through a UART or USB it is connected  to an external host processor, which executes the upper Blueooth® stack (L2CAP, RFCOMM) and profiles.
Beyond the upper stack the host processor runs the application software.  This application processor may also run additional tasks such as middleware and multimedia functions.  This concept is suitable for voice and data.

TC35661 Embedded Profile System Concept


The Embedded Profile model integrates both the lower and upper stack as well as some selected profiles in the TC35661SBG (ROM or external flash memory).  The UART interface carries the data of a higher layer API.  The  whole Bluetooth® functionaly is managed by the Bluetooth® LSI.  The host processor only handles the application data.  Depending on the complexity of the application the host CPU performance requirement can be very minor.  This concept is for data only.  The Embedded Profile models for BT4.0 features Smart Ready (dual mode) or Smart (BLE single mode) Bluetooth® marking.

TC35661 Stand Alone System Concept

TC35661SBG Stand Alone System Concept

TC35661 can be run without an additional host MCU for small applications.  The application code gets stored into the attached EEPROM.  After RESET the code is bootloaded into the embedded SRAM of TC35661-7xx/1xx and executed by the Bluetooth processor itself.  This feature is available together with devices containing the Bluetooth stack with embedded SPP profile (-7xx) or HID profile (-1xx) in ROM.  Toshiba uses commercial debugger software to allow evaluation of the application code.

Toshiba Embedded Profile Software Models

Profile API
LC/LMP (v4.0)
with Serial Port Profile (SPP)
for wireless cable replacement
RFCOMM Attribute Profile
LC/LMP (v4.0)
with GATT and SPP profile for BT 4.0
dual mode enabled accessory products

TC35661 Datasheets More

Bluetooth® Testing

Further Information

The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc.

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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.