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ULTIMATE TECHNOLOGIES INCORPORATED
BOARD MANUFACTURING DATA
2019/05/08
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BOARD NAME       : RD001

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PHOTO DATA
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PHOTO            : ****.phd
DATALIST         : ****.phl

LAY1              : L1.***
LAY2 NegaFilm     : L2-nega.***
LAY2 PosiFilm     : L2-posi.***
LAY3 NegaFilm     : L3-nega.***
LAY3 PosiFilm     : L3-posi.***
LAY4 NegaFilm     : L4-nega.***
LAY4 PosiFilm     : L4-posi.***
LAY5 NegaFilm     : L5-nega.***
LAY5 PosiFilm     : L5-posi.***
LAY6              : L6.***
LAY1 SilkMarking  : SSA.***
LAY6 SilkMarking  : SSB.***
LAY1 SolderResist : RSA.***
LAY6 SolderResist : RSB.***
LAY1 MetalMask    : MEA.***
LAY6 MetalMask    : MEB.***
OUTLINE           : OWF.***


Note : Please refer to the solder resist data regarding the silk-marking cut
       Please combine the positive and negative film.
       (Please refer to the reference PCB/PWB drawing data.)

       *D75 of Gerber data is the outline data containing the router locus etc.
        Don't output D75 in working film.

       *D10 of RS274XGerber data is the outline data containing the router locus etc.
        Don't output D10 in working film.


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DRILL DATA
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DRILL            : ****.drd
DATALIST         : ****.drl

Slotted TH        : Oblong-TH.***
Slotted NTH       : Oblong.***


Hole Diameter    : Drill Diameter (Finished hole size)
Tolerance        : TH    +0.05mm  -0.05mm
                   NTH  Less than 3.2:}0.05mm,3.2 or more:}0.1mm


