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In developing your designs, please ensure the datasheet.

Mounting Surface Mount
Pins 18
Package Dimensions (mm)
Land pattern dimensions for
reference only (mm)

Package SSOP18-P-225-0.65
Land pattern SSOP18-P-225-0.65_LP
Thermal resistance (℃/W) -
Packing Method -
Semiconductor Package
Mount Manual
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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.