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Custom SoCs

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Packaging Technology

Package Offerings

Package requirements vary with each application system in which ASICs are incorporated. To satisfy all application needs, Toshiba offers a broad range of packaging options, based on small-form-factor and lightweight, low-profile, high-pin-count, high-speed and thermal dissipation technologies.

Package Offerings

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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.
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