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Toshiba offers an extensive lineup of stepping motor drivers fabricated using a BiCD process that provides high accuracy and high-current capability. Toshiba's stepping motor drivers are available in bipolar and unipolar configurations.

Product Lines

Product Lines: Stepping Motor Drivers

*1 The TB67S105 and TB67S145 do not support micro-stepping.

Stepping Motor Drivers

Stepping Motor Drivers Product Lineup

Features of Toshiba's Stepping Motor Drivers

Extensive product lineup

Extensive product lineup

Solutions for customers' needs and issues based
on leading-edge technologies

Solutions for customers' needs and issues based on leading-edge technologies

Toshiba's Original Technologies

1. Advanced Dynamic Mixed Decay (ADMD) Technology

Toshiba's original ADMD technology tracks input current more closely than the conventional mixed-decay mode, making highly efficient motor control possible at high rpm.

Conventional Mixed Decay:Missed step at high rpm / ADMD Technology:Precise microstep control even at high rpm

Products incorporating the ADMD technology:
TB67S101A TB67S102A TB67S103A TB67S105 TB67S109A TB67S261 TB67S265 TB67S269

2. Advanced Current Detect System (ACDS) Technology

Toshiba's original ACDS technology enables motor drive with highly accurate constant current without requiring external current-sensing resistors.
The reduced part count also helps reduce the board area and the bill-of-material (BOM) cost.

Conventional Technology:Two resistors with high electrical ratings are necessary. / ACDS Technology:No external resistor is required.

Products incorporating the ACDS technology:
TB67S141 TB67S142 TB67S145 TB67S149 TB67S179

3. High-Voltage Analog Process Technology

Fabricated using a state-of-the-art high-voltage analog process (130-nm BiCD process), Toshiba's stepping motor drivers combine low-voltage control circuitry with high-voltage DMOS output drivers on the same monolithic structure. Consequently, high-voltage motor drivers rated at 84 V can be housed in the small WQFN48 (7 mm × 7 mm) package, which helps reduce the solution size.

Package footprint: Approx. 30% reduction

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