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NAND Interface: SmartNAND™

The ECC and other functions are implemented into the SmartNAND™ product, keeping NAND flash memory (NAND) interface and physical address access method. Therefore, it is unnecessary for a host controller side to manage stronger ECC requirement any more based on every generation process technology shrink of the NAND. Although the host controller side needs to manage the usual block management and wear leveling, there is no necessity of ECC treatment which is causing burden of developing a host controller any more. As a result, an existing host side controller can use advanced NAND with SmartNAND™ solution. On the other hand a new host controller can use Toggle DDR1.0 for faster speed performance besides Legacy(SDR).

NAND_IF_SNAND_e

NAND flash memory management like wear-leveling and bad block management needs to be handled by the host side. Block erase is also necessary as well as raw NAND flash memory.

 Product List of SmartNAND™
Capacity Part Number DQ
Interface
Page Size
(Byte)
/CE Signal &
Ready/Busy Signal
Power Supply Operation Temperature
(℃)
Package
 VCC(V)  
  VCCQ(V)   
4 GByte THGBR2G5D1JTA00 Legacy(SDR) 16K 1 & 1 2.7 to 3.6 2.7 to 3.6 ,
1.7 to 1.95
0 to 70 (Note) 48 pin TSOP
8 GByte THGBR2G6D1JTA00 Legacy(SDR) 16K 1 & 1 2.7 to 3.6 2.7 to 3.6 ,
1.7 to 1.95
0 to 70 (Note) 48 pin TSOP
THGBR2G6D1JBA01 Legacy(SDR) 16K 1 & 1 2.7 to 3.6 2.7 to 3.6 ,
1.7 to 1.95
0 to 70 (Note) 132 ball BGA
THGBT2G6D1JBA01 Toggle DDR1.0 16K 1 & 1 2.7 to 3.6 2.7 to 3.6 ,
1.7 to 1.95
0 to 70 (Note) 132 ball BGA
16 GByte THGBR2G7D2JBA01 Legacy(SDR) 16K 2 & 2 2.7 to 3.6 2.7 to 3.6 ,
1.7 to 1.95
0 to 70 (Note) 132 ball BGA
THGBT2G7D2JBA01 Toggle DDR1.0 16K 2 & 2 2.7 to 3.6 2.7 to 3.6 ,
1.7 to 1.95
0 to 70 (Note) 132 ball BGA
32 GByte THGBR2G8D4JBA01 Legacy(SDR) 16K 2 & 2 2.7 to 3.6 2.7 to 3.6 ,
1.7 to 1.95
0 to 70 (Note) 132 ball BGA
THGBT2G8D4JBA01 Toggle DDR1.0 16K 2 & 2 2.7 to 3.6 2.7 to 3.6 ,
1.7 to 1.95
0 to 70 (Note) 132 ball BGA
64 GByte THGBR2G9D8JBA01 Legacy(SDR) 16K 2 & 2 2.7 to 3.6 2.7 to 3.6 ,
1.7 to 1.95
0 to 70 (Note) 132 ball BGA
THGBT2G9D8JBA01 Toggle DDR1.0 16K 2 & 2 2.7 to 3.6 2.7 to 3.6 ,
1.7 to 1.95
0 to 70 (Note) 132 ball BGA

(Note) If the operation temperature range of -40 to 85 ℃ is preferred, please contact your local Toshiba sales representative.

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MLC NAND(컨트롤러 탑재 NAND 솔루션)

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