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This online document describes design techniques and mounting methods for improving the solder ability and heat dissipation of our products, and aims at producing the printed circuit board assembly (PCBA) with high manufacturability.
Package Name
3D Model STEP
Land pattern(2D Model) Cadence
Land pattern(2D Model) DXF
Land pattern(2D Model) LPB
Land pattern(2D Model) Zuken
Number of pins
Width×Length×Height
(mm)
Package Size
(mm^2)
Mount
Product Category
Package Name | 3D Model | Land pattern(2D Model) | Number of pins | Width×Length×Height (mm) |
Package Size (mm^2) |
Mount | Product Category | |||
---|---|---|---|---|---|---|---|---|---|---|
STEP | Cadence | DXF | LPB | Zuken | ||||||
Total:170
Hit Count:45
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