Multi-Chip Discrete Devices

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Part Number
Datasheet

Total: 14

Hit Count: 14

Link  

Life-cycle  

Configuration  

(Q1)
VCEO (Max)
(V)
 

(Q1)
VDS (Max)
(V)
 

(Q1)
VR (Max)
(V)
 

(Q1)
IC (Max)
(A)
 

(Q1)
ID (Max)
(A)
 

-2,-1.5,-1.3,-1,-0.1,0.1,1.4,1.5,1.6,1.9,2,2.4 numeric
2.4
-2

(Q2)
VCEO (Max)
(V)
 

(Q2)
VDS (Max)
(V)
 

(Q2)
VR (Max)
(V)
 

(Q2)
IC (Max)
(A)
 

(Q2)
ID (Max)
(A)
 

Number of pins  

Surface mount package  

Package name
(Toshiba)
 

Width×Length×Height
(mm)
 

Package Size
(mm^2)
 

PageSize:1
Part Number
Datasheet
Link Life-cycle Configuration (Q1)
VCEO (Max)
(V)
(Q1)
VDS (Max)
(V)
(Q1)
VR (Max)
(V)
(Q1)
IC (Max)
(A)
(Q1)
ID (Max)
(A)
(Q2)
VCEO (Max)
(V)
(Q2)
VDS (Max)
(V)
(Q2)
VR (Max)
(V)
(Q2)
IC (Max)
(A)
(Q2)
ID (Max)
(A)
Number of pins Surface mount package Package name
(Toshiba)
Width×Length×Height
(mm)
Package Size
(mm^2)
Total:14

Hit Count:14








-2,-1.5,-1.3,-1,-0.1,0.1,1.4,1.5,1.6,1.9,2,2.4 numeric
2.4
-2










HN2E04F StockCheck PNP + Small-signal SW diode -120 -0.1 80 6 Y SM6 2.9 x 2.8 x 1.1 8.12
SSM5G02TU StockCheck P-ch MOS + SBD -12 -1 12 5 Y UFV 2.0 x 2.1 x 0.7 4.20
SSM5G06FE StockCheck P-ch MOS + SBD -20 -0.1 12 5 Y ESV 1.6 x 1.6 x 0.55 2.56
SSM5G09TU StockCheck P-ch MOS + SBD -12 -1.5 12 5 Y UFV 2.0 x 2.1 x 0.7 4.20
SSM5G11TU StockCheck P-ch MOS + SBD -30 -1.3 5 Y UFV 2.0 x 2.1 x 0.7 4.20
SSM5H01TU StockCheck N-ch MOS + SBD 30 1.4 20 5 Y UFV 2.0 x 2.1 x 0.7 4.20
SSM5H06FE StockCheck N-ch MOS + SBD 20 0.1 12 5 Y ESV 1.6 x 1.6 x 0.55 2.56
SSM5H08TU StockCheck N-ch MOS + SBD 20 1.5 20 5 Y UFV 2.0 x 2.1 x 0.7 4.20
SSM5H11TU StockCheck N-ch MOS + SBD 30 1.6 5 Y UFV 2.0 x 2.1 x 0.7 4.20
SSM5H16TU StockCheck N-ch MOS + SBD 30 1.9 5 Y UFV 2.0 x 2.1 x 0.7 4.20
SSM5H90ATU StockCheck New Product N-ch MOS + SW-DI 20 2.4 80 5 Y UFV 2.0 x 2.1 x 0.7 4.20
SSM6G18NU StockCheck P-ch MOS + SBD -20 -2 6 Y UDFN6 2.0 x 2.0 x 0.75 4.00
SSM6H19NU StockCheck N-ch MOS + SBD 40 2 40 6 Y UDFN6 2.0 x 2.0 x 0.75 4.00
TPCP8R01 StockCheck N-ch MOS + ZNR 60 2 8 Y PS-8 2.9 x 2.8 x 0.8 8.12
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