Discrete Device Packages

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Package Name

Total: 166

Hit Count: 8

3D Model STEP  

Land pattern(2D Model) Cadence  

Land pattern(2D Model) DXF  

Land pattern(2D Model) LPB  

Land pattern(2D Model) Zuken  

Number of pins  

Width×Length×Height
(mm)
 

Package Size
(mm^2)
 

Mount  

Product Category  

PageSize:1
Package Name 3D Model Land pattern(2D Model) Number of pins Width×Length×Height
(mm)
Package Size
(mm^2)
Mount Product Category
STEP Cadence DXF LPB Zuken
Total:166

Hit Count:8










DIP26 STEP 26 32.0 x 16.6 x 3.6 531.20 Through Hole Intelligent Power ICs
HSSOP31 STEP 31 17.5 x 11.93 x 2.2 208.78 Surface Mount Intelligent Power ICs
PS-8 (SON8-P) 8 2.9 x 2.8 x 0.8 8.12 Surface Mount Intelligent Power ICs
SOP-8 8 5.0 x 6.0 x 1.5 30.00 Surface Mount Intelligent Power ICs
SSOP24 STEP Cadence DXF LPB Zuken 24 13.5 x 8.0 x 1.5 108.00 Surface Mount Intelligent Power ICs
SSOP30 STEP Cadence DXF LPB Zuken 30 20.0 x 14.2 x 2.2 284.00 Surface Mount Intelligent Power ICs
WQFN32 32 5.0 x 5.0 x 0.75 25.00 Surface Mount Intelligent Power ICs
WSON10 STEP Cadence DXF LPB Zuken 10 3.0 x 3.0 x 0.75 9.00 Surface Mount Intelligent Power ICs
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