Discrete Device Packages

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Package Name

Total: 170

Hit Count: 6

3D Model STEP  

Land pattern(2D Model) Cadence  

Land pattern(2D Model) DXF  

Land pattern(2D Model) LPB  

Land pattern(2D Model) Zuken  

Number of pins  

Width×Length×Height
(mm)
 

Package Size
(mm^2)
 

Mount  

Product Category  

PageSize:1
Package Name 3D Model Land pattern(2D Model) Number of pins Width×Length×Height
(mm)
Package Size
(mm^2)
Mount Product Category
STEP Cadence DXF LPB Zuken
Total:170

Hit Count:6










MP6C STEP Cadence DXF LPB Zuken 6 1.45 x 1.0 x 0.55 1.45 Surface Mount Linear ICs
SM8 STEP Cadence DXF LPB Zuken 8 2.9 x 4.0 x 1.1 11.60 Surface Mount Linear ICs / Logic ICs
SMV STEP Cadence DXF LPB Zuken 5 2.9 x 2.8 x 1.1 8.12 Surface Mount Diodes / Bipolar Transistors / Power Management ICs / Linear ICs / Logic ICs
UFV STEP Cadence DXF LPB Zuken 5 2.0 x 2.1 x 0.7 4.20 Surface Mount Diodes / Bipolar Transistors / Power Management ICs / Linear ICs / Sensors
US8 STEP Cadence DXF LPB Zuken 8 2.0 x 3.1 x 0.7 6.20 Surface Mount Logic ICs / Linear ICs
USV STEP Cadence DXF LPB Zuken 5 2.0 x 2.1 x 0.9 4.20 Surface Mount Diodes / MOSFETs / Bipolar Transistors / Logic ICs / Linear ICs
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