Do the technical datasheets of diodes specify thermal resistance from the junction to the ambient?

Toshiba specify the thermal resistance from the junction to the case in the technical datasheet of the diode in the lead type package but does not specify it in the technical datasheet of the diode in the surface mount type package.

This is because surface mount type packaged products have a small amount of self-heating and the surface temperature of the package cannot be measured accurately.
However, the thermal resistance from junction to ambient (Rth (j-a)) is described, so please use that for heat dissipation design.

For thermal design, please refer to the following application note.

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