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封裝及包裝資訊

We introduce package dimensions and packing methods of Toshiba semiconductor.
In developing your designs, please ensure the datasheet.

By products

IC packages by type

QFP
DIP
QFN
ZIP
SOP

Package Mounting Guide

This online document describes design techniques and mounting methods for improving the solder ability and heat dissipation of our products, and aims at producing the printed circuit board assembly (PCBA) with high manufacturability.

·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.