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Part Numbering Nomenclature

Clicking on product's category allows you to see Microcomputer Part Naming Conventions.

  • Example 1) TMP89FS60xxUG

    Example 1 of Microcomputer

    1. Toshiba microcontrollers
    2. Microcontroller core
       89: 870/C1  92: 900/H1
    3. ROM type
       C: Mask  E: EEPROM  F: Flash  P: OTP
    4. ROM size
      1 2 3 4 6 8 C H K M N P S U W F Y Z D
      KB 1 2 3 4 6 8 12 16 24 32 40 48 60/64 96 124/128 192 256 384 512
    5. Microcontroller subtype
    6. Microcontroller revision
    7. Automotive quality grade
       R: Grade A, -40°C to +85°C T: Grade A, -40°C to +125°C
       I: Grade B, -40°C to +85°C S: Grade B, -40°C to +125°C
    8. Package
       QG: Plastic shrink quad outline non-leaded package (VQON); dry-packed
       XBG: Plastic ball grid array (BGA); dry-packed
       WBG: Wafer-level chip size package (WCSP); dry-packed
       UG, DUG, FG, DFG: Plastic quad flat package (QFP); dry-packed
       MG, DMG: Plastic small-outline package (SOP); dry-packed
       NG: Plastic shrink dual-in-line package (SDIP)

  • Example 2) TMPM369FDxxXBG

    Example 2 of Microcomputer

    1. Toshiba microcontrollers
    2. Microcontroller core
       M0: 00  M3: 03  M4: 04  R4: 04R  A9: 09  19A: 19A, 19A/H1
    3. Microcontroller subtype
    4. ROM type
       C: Mask  F: Flash
    5. ROM size
      H M R S W Y Z D E 10 15 20
      KB 16 32 56 64 128 256 384 512 768 1024 1536 2048
    6. Microcontroller revision
    7. Automotive quality grade
       R: Grade A, -40°C to +85°C T: Grade A, -40°C to +125°C
       I: Grade B, -40°C to +85°C S: Grade B, -40°C to +125°C
    8. Package
       QG: Plastic shrink quad outline non-leaded package (VQON); dry-packed
       XBG: Plastic ball grid array (BGA, FBGA, TFBGA, VFBGA); dry-packed
       UG, FG, DFG: Plastic quad flat package (QFP, LQFP, HQFP); dry-packed
       DMG: Plastic small-outline package (SOP); dry-packed
       NG: Plastic shrink dual-in-line package (SDIP)

  • Example 3) TMPM3H4FWxUG

    Example 3 of Microcomputer

    1. The identification of Toshiba microcontrollers.
    2. Core
       M4: ARM Cortex-M4  M3: ARM Cortex-M3  M0: ARM Cortex-M0
    3. Product Group
       TXZ family is written in alphabet and TX family is numbers.
       H: For General-purpose/Consumer electronic equipment
       K: For Motor/Inverter control industrial equipment(MCU+AMP/COMP)
       G: For OA/Digital equipment/industrial equipment
       E: For Robotics, precision instruments control
       P: For Healthcare / Battery equipment
    4. Pin Count
       Within the same group, numbers and alphabets may be used properly depending on the difference in SPEC even with the same pin count.
        Pin Count
      0 G ≤32Pins
      1 H 33Pins≤, ≤44Pins
      2 J 45Pins≤, ≤48Pins
      3 K 49Pins≤, ≤52Pins
      4 L 53Pins≤, ≤64Pins
      5 M 65Pins≤, ≤80Pins
      6 N 81Pins≤, ≤100Pins
      7 P 101Pins≤, ≤128Pins
      8 Q 129Pins≤, ≤144Pins
      9 R 145Pins≤, ≤176Pins
      A S 177Pins≤, ≤200Pins
      B T 201Pins≤, ≤224Pins
      C U 225Pins≤, ≤250Pins
      D V 251Pins≤, ≤300Pins
    5. ROM type
       F: Flash C: Mask
    6. ROM size
      M P S U W Y Z D E 10 15 20 40 80
      KB 32 48 64 96 128 256 384 512 768 1024 1536 2048 4096 8192
    7. Revision
    8. Package
       QG: Plastic shrink quad outline non-leaded package; dry-packed
       UG, DUG, FG, DFG: Plastic quad flat package; dry-packed
       MG, DMG: Plastic small-outline package ; dry-packed
       XBG: Plastic ball grid array ; dry-packed

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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.