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As in-vehicle infotainment (IVI) systems, along with other automotive systems, become more sophisticated, requiring greater functionality and higher performance, an interface gap problem between peripheral devices and Systems-on-chip (SoCs) easily arises. Toshiba interface bridge ICs can help to solve this problem.

TC9560XBG [開發中] / TC9560AXBG / TC9560BXBG [開發中]


  1. TC9560XBG支援IEEE 802.1AS和IEEE 802.1Qav等通常涉及到乙太網AVB的標準。TC9560XBG連接至應用處理器或其它SoC主機後,就可以允許主機設備通過汽車內的10/100/1000乙太網路傳輸音訊、視頻和資料。
  2. 與主機的連接是通過PCIe®,它運行于適合音訊流的2.5/5.0GT/s(PCIe Gen1.0/2.0),480Mbps HSIC或TDM(時分多路傳輸)/I2S。
  3. 提供乙太網PHY介面,可以選擇RGMII、RMII和MII*(*) 計畫支援MII.
  4. 設計目標是實現低功率模式,即室溫下通常消耗0.25mW(由東芝測量)。TC9560XBG通常只需要100ms的時間即可返回至正常操作狀態(由東芝測量),這就滿足了市場需求。TC9560XBG將計畫通過AEC-Q100標準3級資質要求。
System Block Diagram
  • 範例 
  • 介面連結範例
TC9560 系列料號 TC9560XBG** TC9560AXBG TC9560BXBG**
封裝 PLFBGA170 (0.65)
應用 Ethernet AVB Bridge Solution For Automotive Applications
產品功能及特性 Host (External application) I/F: -
  • PCIe I/F [Gen2.0 (5 GT/s), Gen1.0 (2.5 GT/s), Endpoint, Single lane]
  • HSIC I/F (480 Mbps)
- -
Automotive I/F:
  • Ethernet AVB [IEEE802.1AS, IEEE 802.1Qav].
    The interface is selectable from RGMII, RMII and MII (Support for MII is being planned), MAC
  • CAN-FD (2 ch)
- -
Audio I/F: I2S/TDM
Peripheral I/F: I2C/SPI, Quad-SPI, UART, GPIO, INTC
CPU Core: ARM®Cortex®-M3
電源電壓 (V) 1.8/3.3 for IO, 1.2 for HSIC, 1.2/2.5/3.3 for RGMII/RMII/MII, 1.1 for Core

**: Under development



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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.