Solder micro-bumps provide high-pin-count chip-to-chip connections, making it possible to realize both high bandwidth and low power consumption.
|LPDDR3||SCS with Custom DRAM|
|Total DRAM Power*[W]||3.84||1.50|
|Data width [bit/unit]||32||2048|
|# of DRAMs||8||1|
|interface speed [Mbps]||1600||200|
|Total bandwidth [GB/s]||50||50|
* excluding SoC power