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MOSFET
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By mounting a Cu connector with a lower resistance value than aluminum or other bonding wire, low on-resistance characteristics and large current correspondence are realized. Products with on-resistance standard value less than 1 mΩ are deployed.
| Package | RDS(ON) (Max) | Lineups |
|---|---|---|
| DPAK type | 1.35mΩ@10V (DPAK+) | Lineups |
| SOP type | 0.79mΩ@10V (SOP Advance) | Lineups |
| TSON type | 4.1mΩ@10V (TSON Advance) | Lineups |
