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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
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Tell me about thermal design.

Ensure that the power dissipation (PD) of a general-purpose CMOS logic IC do not exceed its absolute rating.

Junction (chip) temperature can be calculated as shown below. In the case of general-purpose CMOS logic, it is used as a parameter in calculating service life as part of reliability evaluation.

Tj=θja・PD+Ta

Tj=θjc・PD+Tc

θJa=θjc+θca

[Figure: Heat transfer resistance of the package]

Symbol Unit Item
Tj °C Junction (chip) temperature
Tc °C Case temperature
Ta °C Ambient temperatures
PD W Power dissipation

θja

°C/W Heat transfer resistance from the case to periphery

θjc

°C/W Heat transfer resistance from junction to the case

θca

°C/W Heat transfer resistance from the case to periphery
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