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About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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Ultra-Small One-Gate CMOS Logic ICs in 1010 Package

The 5-pin fSV (SOT-953) package, which measures 1.0 mm × 1.0 mm × 0.48 mm, occupies only 1.0 mm2 of board space. It is ideal for applications that require high-density board assembly such as cell phones.

Ultra-Small and Thin fSV Package

Ultra-Small and Thin fSV Package

  • Package Dimensions : 1.0 mm × 1.0 mm × 0.48 mm (typ.)
  • Lead pitch : 0.35 mm
Package Dimensions
Package Dimensions
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Land Pattern Example

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