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Toshiba Introduces Photocouplers for High-Speed Communications

Housed in Small Packages with Reinforced Isolation

IRVINE, Calif., October 10, 2017Toshiba America Electronic Components, Inc. (TAEC)* today announced two photocouplers for high-speed communications: the TLP2767 and TLP2367. The new photocouplers are housed in small, 2.3mm (max) low-height packages and meet various international safety standards, including UL1577 and EN60747-5-5. They are designed for applications such as programmable logic controllers, I/O interface boards, photovoltaic inverters, and factory automation inverters.


The TLP2767 is the first 50Mbps photocoupler in the industry to provide both a creepage and clearance distance of 8mm and isolation thickness of 0.4mm, supporting reinforced isolation. It features isolation voltage of 5000Vrms (min) and is housed in a SO6L package. The TLP2367 provides creepage and clearance distance of 5mm (min) and isolation voltage of 3750Vrms. It is available in a 5-pin SO6 package. Both the TLP2767 and TLP2367 contribute to lowering the operation voltage of equipment with supply voltage of 2.7V to 5.5V, at temperatures up to 125°C.


With a propagation delay time of 20ns (max), pulse width distortion of 8ns (max), and propagation delay skew of ±10ns (max), the photocouplers can be used to reduce the dead time of various interfaces, which can improve the power efficiency of equipment. On the input side, the TLP2767 and TLP2367 feature Toshiba's original high output infrared LEDs to reduce the threshold input current by approximately 20 percent, compared with existing Toshiba products[1]. On the output side, a photo detector IC fabricated with a CMOS process reduces the supply current by approximately 50 percent, compared with existing Toshiba products[1]. This can lower power consumption and cost reduction of equipment. 


Main Specifications
(Isolation voltage @Ta=25°C, Other characteristics @Ta=-40 to 125°C)

 Part number

      Package

Creepage distances min

(mm)

Absolute maximum ratings

Supply current IDDH, IDDL max (mA)

Threshold input current(H→L)

IFHL max

(mA)

Data Transmission rate typ. (MHz)

Propagation delay time tpHL, tpLH max

(ns)

Pulse width distortion

|tpHL-tpLH| max

(ns)

Common-mode transient immunity CMH, CML min

(kV/μs)

Isolation voltage BVS (kVrms)

TLP2367

5-pin SO6

5

3.75

2.5

4

50

20

8

±25

TLP2767

SO6L

8

5


Pricing and Availability

Toshiba’s new photocouplers are now shipping. For more details, samples and pricing information, please contact your local Toshiba Sales Office.


About Toshiba Corp. and Toshiba America Electronic Components, Inc. (TAEC)

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs and distributors. A committed electronic components leader, Toshiba designs and manufactures high-quality hard disk drives (HDDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, and advanced materials that make possible today’s leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions, consumer products and more.


Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc. For over 140 years, Toshiba Corporation has contributed to a sustainable future by applying innovative technologies to value creation. Today, our business domains are centered on the essential infrastructure that supports modern life and society. Guided by the principles of The Basic Commitment of the Toshiba Group, “Committed to People, Committed to the Future”, Toshiba promotes global operations that contribute to realization of a world where generations to come can live better lives. Visit Toshiba's web site at http://toshiba.semicon-storage.com


1Toshiba’s TLP117 (MFSOP6 package)


Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.

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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.