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DIP16

In developing your designs, please ensure the datasheet.

DIP16package
Mounting Through Hole
Pins 16
Package Dimensions (mm)
Package DIP16-P-300-2.54A
Thermal resistance (℃/W) 56.2
Packing Method -
Semiconductor Package
Mount Manual
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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.