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DIP18

In developing your designs, please ensure the datasheet.

DIP18package
Mounting Through Hole
Pins 18
Package Dimensions (mm)
Thermal resistance (℃/W) -
Packing Method -
Semiconductor Package
Mount Manual
-
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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.