WCSP9

In developing your designs, please ensure the datasheet.

WCSP9package
Toshiba Package Code S-UFBGA9-0202-0.50-001
Mounting Surface Mount
Pins 9
Width×Length×Height
(mm)
1.5×1.5×0.54
Land pattern(2D Model)
3D Model STEP
Package Dimensions (mm)
/
Land pattern dimensions for
reference only (mm)

Packing Method Embossed Tape
Packing Name TE85L / L
Minimum Quantity 5000 pcs/Reel
Tape Width (mm) 8
Tape Dimensions (mm)
/
Reel Dimensions (mm)

Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3.

  • 3D model(.stp): 3D model Data in STEP Format
  • Land Pattern(.dxf): Land pattern Data in DXF Format
  • Land Pattern(.xml):Land pattern Data in JEITA LPB C-format
  • Land Pattern(.dra):Land pattern Data for Cadence®OrCAD®
  • Land Pattern(.ftp): Land pattern Data for Zuken®CR-5000/CR-8000
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