Contact us

A new window will open A new window will open

ASIC Datacenter

White Papers




  • Custom ASIC Overview

    Toshiba is a leading semiconductor manufacturer and a provider of advanced custom ASIC solutions for high performance datacenter, networking, and storage markets We also manufacturer acceleration engines for application and domain-specific architectures and numerous other markets. Whether for high-volume edge solutions found in industrial and consumer markets to solutions found in the core of the datacenter, Toshiba custom ASIC customers choose Toshiba for our ability to deliver reliable, cost-effective, energy efficient, and secure solutions.

    Market leaders select Toshiba for our ASIC experience and ability to provide optimized, power efficient solutions, and advanced ASIC capabilities that extend to sub-10nm designs, billion-gate and multi-million byte memory solutions.

    Toshiba offers customers access to state-of-the-art SerDes, high-speed memory interfaces, CNN/DNN engines, and advanced packaging technology enabling our customers to create the industry’s most advanced and innovative products. Our rich portfolio of verified and proven in-house and third-party IP and sub-systems enable timely delivery of customer solutions and complete system-on-chip solutions for many markets.

    Toshiba ASIC services are tuned to address the needs of our ASIC customers. From architectural definition, product design, package and thermal issues, and manufacturing and test of the final product, Toshiba offers the expertise to address our customers’ needs.

    Toshiba has successfully delivered hundreds of ASIC solutions to customers. We understand the importance of our development to your success.

  • Datacenter Solutions

    Driven by high server utilization and high performance storage, low-power high-performance networking and interconnect solutions are becoming the norm in datacenter applications.         

    Enabling industry-leading datacenter performance, Toshiba offers a portfolio of high speed SerDes sub-systems with multiple lanes of 56Gbps, advanced packaging technology, high performance PCIe, and specialized cores such as embedded TCAM.  

    ASIC Product Examples

    Data center customers are looking into using custom silicon solutions for certain applications such as machine learning, network security, virtualization and video processing. Custom ASICs offer a superior solution for these types of applications when compared to an off-the-shelf CPU and can also complement the CPU to provide more efficiency. We refer to this type of a custom silicon as a CPU accelerator.

    CPU Accelerator

  • Storage Solutions

    Toshiba – a long time industry-leader in storage – has created an extensive portfolio of storage IP that can be leveraged by customers developing their own storage solutions for such storage products as flash arrays, NVDIMMs and SSDs.

    Storage Product Examples

  • Artificial Intelligence / Machine Learning

    With a strong history and experience in Artificial Intelligence / Machine Learning (AI/ML), Toshiba has been using such technologies in its own processes and products. In areas such as manufacturing production improvement, Toshiba engages visual and big data analytics for flaw inspections and electrical characteristics inspection for creating high quality systems and devices.

    Other visual areas also include driving safety such as products for ADAS. Toshiba has long been behind the ADAS technologies in automotive vehicles where intelligence and safety is paramount.  Major automotive OEMs have used Toshiba ADAS components in their cars for several generations. AI/ML is playing a larger role that brings safer drivers and vehicles to the world. 

    Toshiba is at the forefront of creating systems for real time perception technologies such as for voice.  Toshiba’s Voice Trigger Engine techniques are used in many appliances all over the world to provide ease of use and better man-machine interfaces.

    Artificial Intelligence

    Toshiba has the experience and expertise to bring your AI/ML system to life. When considering ASICs for AI/ML applications, a wealth of neural network instantiations and options may be examined. Designers and architects may consider Neural Networks based on DSPs or actual neural networks comprised of individual cross-connected MACs.   Each type should be evaluated carefully as each will have positive and negative attributes for a particular AI/ML application.

    Current trends in AI are to migrate much of the inference tasks from the central data center to the edge devices such as phones, cars, drones, robots, speakers, AR/VR HMDs, etc.

    Data Center Cloudamd Edge Devices

    There are several reasons for this migration trend. Technical reasons include datacenter power, costs and bandwidth. However a major component is from user experience in terms of latency and device response.   One would not want to be in a fast moving driverless car that relies on a remote datacenter to get its driving instructions.   

    Why is ML Moving from CLoud to the Edge?

    Legality and privacy concerns are also reasons for why some data should stay local and not be transferred to the cloud. Recent concerns over privacy have made it even more imperative that sensitive data does not get transferred outside of the edge system.  

    AI/ML tasks need to be planned to make it as efficient as possible.  AI/ML systems should be segmented to either make the training task or the inference task more efficient and effective. These tasks can be mutually exclusive in terms of calculations and memory handling for setting or retrieving weights, etc. 

    Developers of AI/ML ASICs need to consider whether the targeted device is to reside in the datacenter for training/inference workloads or on the edge for inference activities. This will force the determination of several factors such as computational requirements, memory bandwidth and other characteristics that will envelope and shape the final ASIC SoC device.     

    One of the special items that needs to be considered during the initial architectural exercise is to determine how to load a trained network into your SoC device especially if the training is to be done in another system and the trained weights need to be loaded and replicated on an edge device.  

    Training Process and Real Time Process

    This is needed as the system that needs to do the inference task is not typically the same system that needs to do the training. Training requires extended calculations and high memory bandwidth that is typically out of scope for most edge devices in terms of power and calculation resources.  

    Toshiba can help with your AI/ML endeavors.  With a deep history and experience of AI/ML, Toshiba understands the complexities of developing DNNs devices. A wide breadth of AI/ML specific options can be considered and are offered by Toshiba. Talk to a Toshiba representative to get the full picture.

  • IP Cores

    Toshiba offers a rich tool-box of verified intellectual property (IP) cores to accelerate customers’ ASIC designs and reduce development risk. Leveraging both Toshiba’s internal R&D efforts and third-party IP, a rich portfolio of silicon development tools, and the experience that comes with developing many hundreds of ASICs, Toshiba offers some of the most advanced IP and ASIC capabilities on the market.

    For High Performance IP, Toshiba provides the following support:

    • IP subsystem Design & Integration
    • Design for Test
    • Stacking PHYs to minimize die size
    • Package/Interposer design
    • Signal integrity analysis
    • Power integrity analysis
    • PCB board design modeling
    • System Bring-up
    • Qualification & Ramp to Production

    Custom SOC System Design Services

  • Packaging

    Toshiba offers a broad range of packaging options from small-form-factor to high-pin-count and high-speed packages. Toshiba has extensive experience with 2.5D packaging with silicon interposer as well as with 3D packaging and can support high bandwidth memory (HBM) interfaces for datacenter applications.


  • Engagement Models

    Toshiba ASIC customers can customize the engagement model with Toshiba to meet their product and development requirements. With our extensive ASIC development experience, Toshiba can support your design at nearly any stage in the process.

    Flexible collaboration to meet your development style

To Top
·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.