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DSOP Advance, a Thermally Enhanced
Double Side Cooling Package

DSOP Advance

DSOP Advance is a small surface-mount package that has thermal fins at the top and bottom and therefore exhibits excellent thermal performance. DSOP Advance is footprint-compatible with the conventional SOP Advance package. DSOP Advance is suitable for high-density board assembly and helps reduce the size and thickness and improve the efficiency of your applications.

DSOP Advance

DSOP Advance

SOP Advance

SOP Advance

Slide Show Describing DSOP Advance

 

Features of DSOP Advance

  1. Has thermal fins at the top and bottom of the package and therefore exhibits excellent thermal performance
  2. Footprint-compatible with the conventional SOP Advance package
  3. Has lower package resistance than the conventional SOP Advance package
Thermal paths in DSOP Advance

Thermal paths in DSOP Advance

Effect of Double Side Cooling (temperature comparison)

Effect of double-sided cooling (temperature comparison)

  • Simulation conditions

    • PCB: 50*50 mm
    • Covered with copper (Cu) on one side
    • Cu thickness: 70 μm
    • Power dissipation (PD): 8 W
    • Thermal fins
      Dimensions: 31*31*20 mm
      Material: Al

    Thermal Fin

DSOP Advance with Low RDS(on)

Due to lower package resistance, the on-resistance,RDS(ON), of DSOP Advance is 0.05 mΩ lower than that of SOP Advance when a chip of the same size is housed.

Part Number Package
VDSS(V) RDS(ON)(mΩ)
@VGS=10V
Ciss(Typ.)
(pF)

Crss(Typ.)
(pF)

Coss(Typ.)
(pF)

Typ. Max
TPWR8503NL DSOP Advance 30 0.72 0.85 5300 130 2700
TPHR9003NL SOP Advance 30 0.77 0.90 5300 130 2700

Lineups

Part Number VDSS
(V)
RDS(ON)(mΩ) Ciss(Typ.)
(pF)
Crss(Typ.)
(pF)
Coss(Typ.)
(pF)
Qg(Typ.)
(nC)
rg(Typ.)
(Ω)
VGS=10V VGS=4.5V
Typ. Max Typ. Max
TPWR8503NL 30 0.72 0.85 1.0 1.3 5300 130 2700 32 1.2
TPWR6003PL 30 0.36 0.6 0.6 0.84 7700 220 2720 52 0.6
TPWR8004PL 40 0.65 0.8 0.95 1.4 7370 58 1930 103 0.6
TPW1R005PL 45 0.8 0.99 1.2 1.7 7700 76 1860 122 0.6
TPW1R306PL 60 0.95 1.29 1.5 2.3 6250 80 1160 91 0.5
TPW2R508NH 75 2.0 2.5 - - 4600 50 1100 72 1.0
TPW4R008NH 80 3.3 4.0 - - 4100 32 890 59 1.2
TPW4R50ANH 100 3.7 4.5 - - 4000 31 700 58 1.0
TPW3R70APL 100 3.1 3.7 4.1 6.2 4850 29 640 67 2.1
TPW1500CNH 150 13 15.4 - - 1700 7 280 22 4.0
TPW2900ENH 200 24 29 - - 1700 7 180 22 4.0
TPW5200FNH 250 44 52 - - 1700 7 140 22 4.0

Use Parametric Search to find other MOSFETs in the DSOP Advance package.

Considerations for Using DSOP Advance

  • When the top and bottom sides of the DSOP Advance package are firmly fixed, extreme stress due to heating and other factors might cause permanent damage to the package. When you need to attach a stiff object such as a heatsink on the top side, place a cushioning material such as an insulation sheet or thermal conduction gel between the package and the object.
  • The device, when unmounted, withstands a static load of 20 N or more. However, when mounted on a PCB, the device might be damaged if the PCB is curved by the fastening of a heatsink. Adjust the tightening of a heatsink so that the PCB will not be curved.
  • Electricity must not be applied to the top electrode of the DSOP Advance package although it is internally connected to the source. Use the top electrode only for heat removal purposes.
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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.