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Toshiba Adds New Brushed DC Motor Driver IC with wide operating voltage range

5th March 2020

New IC features convenient non-latching overcurrent detection

Toshiba Electronics Europe GmbH has added a new device to its line-up of single channel brushed DC motor driver ICs. Housed in a small HSOP8 package with popular pin-assignment, the new IC enhances product sourcing possibilities and features a convenient non-latching overcurrent detection.

The new TB67H451FNG IC can drive brushed DC motors and supports numerous applications including battery powered devices and other devices with a 5V USB power supply. It is also suitable for use with many 12-36V industrial devices, home appliances such as coffee machines and robotic vacuum cleaners, fiscal printers, and electronic door locks that require a high-current drive of up to 3.5A.

The device is capable of operating from a wide range of input voltages, from 4.5V to 44V. The maximum motor drive output current is 3A at 44V and several protection mechanisms are built-in to the device including undervoltage lock out (UVLO), auto-return thermal shut down and non-latching overcurrent protection (OCP).

OCP is a safety function that prevents damage to the IC by turning off the output when the output current exceeds the pre-set threshold level. Toshiba’s current solution (TB67H450FNG) features a latching overcurrent detection, where output is turned off indefinitely until a power cycle or entering and leaving the standby mode. However, the new TB67H451FNG is non-latching and resumes function automatically after a programmable recovery time once the overcurrent condition is removed.

To meet demand for lower power consumption, Toshiba has also optimized the TB67H451FNG standby current consumption by a power supply circuit, which allows automatic transitions from STOP mode moving to STANDBY mode and turns off the VCC regulator for the internal circuit operation. That helps home appliances to cut standby energy consumption and improves the battery life of battery powered devices.

Housed in a 4.9mm×6.0mm surface-mount type HSOP8 package, the IC achieves space saving and yet good heat dissipation through the package thermal pad design.

Mass production shipments of the TB67H451FNG start today.

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