Product News 2019-03
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched “TCK207AN,” a compact load switch IC with an increased strength package.
The DFN4A package is a newly developed, compact mold resin package. Its higher strength package compared with the conventional WCSP makes it harder for the product to be damaged by contact or impact when or after being mounted on a board. In addition, its low On-resistance and low current consumption contribute to the lower power consumption of devices.
It is suitable for applications such as the power supplies of SSDs requiring high reliability and laptop PCs for use in harsh environments.
 WCSP: Wafer-Level Chip Scale Package
(Unless otherwise specified, @Ta=25 °C)
-40 to 85 °C
|DFN4A||1.2 × 1.2||2.0||0.75 to 3.6||22||21.5||Bulit in||Pull down
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Information in this document, including product prices and specifications, content of services and contact information, is correct on the date of the announcement but is subject to change without prior notice.