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A compact load switch IC with increased strength package using mold resin: TCK207AN

Product News 2019-03

The package photograph of a compact load switch IC with increased strength package using mold resin: TCK207AN.

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched “TCK207AN,” a compact load switch IC with an increased strength package.
The DFN4A package is a newly developed, compact mold resin package. Its higher strength package compared with the conventional WCSP[1] makes it harder for the product to be damaged by contact or impact when or after being mounted on a board. In addition, its low On-resistance and low current consumption contribute to the lower power consumption of devices.
It is suitable for applications such as the power supplies of SSDs requiring high reliability and laptop PCs for use in harsh environments.

Notes:
[1] WCSP: Wafer-Level Chip Scale Package

Features

  • The package strength has been increased with the use of compact mold resin package DFN4A.
  • Low On-resistance: RON=21.5 mΩ (typ.)
  • Low quiescent current (ON state): IQ=22 µA (typ.)

Applications

  • Power supply systems of SSDs, laptop PCs, electronic dictionaries, etc.

Product Specifications

(Unless otherwise specified, @Ta=25 °C)

Part
number
Package Absolute
maximum
ratings
Electrical characteristics Function
Name Size
typ.
(mm)
Output
current
IOUT
(DC)
(A)
Input voltage
VIN
@Ta=
-40 to 85 °C
(V)
Quiescent
current
(ON state)
IQ
typ.
(µA)
On-resistance
RON
typ.
(mΩ)
Output
auto-discharge
Control
pin
connection
DFN4A 1.2 × 1.2 2.0 0.75 to 3.6 22 21.5 Bulit in Pull down
(Active High)

Block Diagram

The illustration of block diagram of a compact load switch IC with increased strength package using mold resin: TCK207AN.

Application Circuit Example

The illustration of application circuit example of a compact load switch IC with increased strength package using mold resin: TCK207AN.

The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass-production design stage.
Providing these application circuit examples does not grant any license for industrial property rights.

Information in this document, including product prices and specifications, content of services and contact information, is correct on the date of the announcement but is subject to change without prior notice.

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