A compact load switch IC with increased strength package using mold resin: TCK207AN
Product News 2019-03
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched “TCK207AN,” a compact load switch IC with an increased strength package.
The DFN4A package is a newly developed, compact mold resin package. Its higher strength package compared with the conventional WCSP[1] makes it harder for the product to be damaged by contact or impact when or after being mounted on a board. In addition, its low On-resistance and low current consumption contribute to the lower power consumption of devices.
It is suitable for applications such as the power supplies of SSDs requiring high reliability and laptop PCs for use in harsh environments.
Notes:
[1] WCSP: Wafer-Level Chip Scale Package
Features
- The package strength has been increased with the use of compact mold resin package DFN4A.
- Low On-resistance: RON=21.5 mΩ (typ.)
- Low quiescent current (ON state): IQ=22 µA (typ.)
Applications
- Power supply systems of SSDs, laptop PCs, electronic dictionaries, etc
Product Specifications
(Unless otherwise specified, @Ta=25 °C)
| Part number |
Package | Absolute maximum ratings |
Electrical characteristics | Function | ||||
|---|---|---|---|---|---|---|---|---|
| Name | Size typ. (mm) |
Output current IOUT (DC) (A) |
Input voltage VIN @Ta= -40 to 85 °C (V) |
Quiescent current (ON state) IQ typ. (µA) |
On-resistance RON typ. (mΩ) |
Output auto-discharge |
Control pin connection |
|
| DFN4A | 1.2 × 1.2 | 2.0 | 0.75 to 3.6 | 22 | 21.5 | Bulit in | Pull down (Active High) |
|
Block Diagram
Application Circuit Example
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass-production design stage.
Providing these application circuit examples does not grant any license for industrial property rights.
Information in this document, including product prices and specifications, content of services and contact information, is correct on the date of the announcement but is subject to change without prior notice.