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Interface Bridge ICs

TC9560XBG [Under Development] / TC9560AXBG [Under Development]

Ethernet AVB Bridge solution for automotive applications.

Network interface for In-Vehicle Infotainment system (IVI) , Telematics and other automotive subsystem.

Features
  1. The TC9560XBG supports standards such as IEEE 802.1AS and IEEE 802.1Qav generally referred to as Ethernet-AVB.
    Connected to an application processor or other SoC host, the TC9560XBG allows the host device to deliver audio, video, and data through the 10/100/1000 Ethernet network in an automotive environment.
  2. The connection to the host is via PCIe® running at 2.5/5.0 GT/s (PCIe Gen1.0/2.0), 480 Mbps HSIC or TDM (Time Division Multiplex)/I2S for audio traffic.
  3. Provides an Ethernet PHY interface selectable from RGMII, RMII and MII*.
    (*) Support for MII is being planned.
  4. The design target is to achieve a low-power mode that typically consumes 0.25 mW at room temperature (measured by Toshiba). The TC9560XBG typically takes only 100 ms to return to normal operation (measured by Toshiba) in order to meet the market need. TheTC9560XBG is scheduled to obtain AEC-Q100 Grade 3 qualification.
System Block Diagram
  • Example

System Block Diagram

  • Interfacing Example

Interfacing Example

Part Number TC9560XBG** TC9560AXBG**
Package PLFBGA170 (0.65)
Applications Ethernet AVB Bridge Solution For Automotive Applications
Functions and Features Host (External application) I/F: PCIe I/F [PCIe Gen2.0 (5 GT/s), PCIe Gen1.0 (2.5 GT/s), Endpoint, Single lane], HSIC I/F (480 Mbps)
Automotive I/F: Ethernet AVB [IEEE802.1AS,
IEEE 802.1Qav]. The interface is selectable from RGMII, RMII and MII (Support for MII is being planned), MAC
Audio I/F: I2S/TDM
Peripheral I/F: I2C/SPI, Quad-SPI, UART, GPIO, INTC
CPU Core: ARM® Cortex®-M3
Host (External application) I/F: PCIe I/F [PCIe Gen2.0 (5 GT/s), PCIe Gen1.0 (2.5 GT/s), Endpoint, Single lane], HSIC I/F (480 Mbps)
Automotive I/F: Ethernet AVB [IEEE802.1AS,
IEEE 802.1Qav]. The interface is selectable from RGMII, RMII and MII (Support for MII is being planned), MAC, 2ch CAN-FD
Audio I/F: I2S/TDM
Peripheral I/F: I2C/SPI, Quad-SPI, UART, GPIO, INTC
CPU Core: ARM® Cortex®-M3
Supply Voltage (V) 1.8/3.3 for IO
1.2 for HSIC
1.8/2.5/3.3 for RGMII/RMII/MII
1.1 for Core

**: Under development

* ARM and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere.

* PCI Express and PCIe are registered trademarks of PCI-SIG.

* System and product names mentioned herein may be trademarks or registered trademarks of respective companies or organizations.

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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.