Toshiba and BASiC Sign MOU on Strategic Partnership in Power Module Products

August 29, 2025

Toshiba Electronic Devices & Storage Corporation

KAWASAKI, Japan– Toshiba Electronic Devices & Storage Corporation ("Toshiba Electronic Devices & Storage") and BASiC Semiconductor Co., Ltd. ("BASiC") have signed a memorandum of understanding (MOU) on building a strategic partnership in power module products. By combining Toshiba Electronic Devices & Storage's high-performance, high-quality power semiconductor technologies, including silicon carbide (SiC) and insulated gate bipolar transistors (IGBT) with BASiC's high-efficiency and high-reliability module architecture, the two companies will deploy competitive products for rapidly evolving automotive and industrial applications worldwide.

The high power density and stable quality of Toshiba Electronic Devices & Storage's power semiconductors contribute to improved power conversion efficiency and reduced environmental impacts. The company’s SiC metal-oxide-semiconductor field-effect transistors (MOSFET) secure low on-resistance and high reliability, while its IGBT have a rich market record of delivering high current and high reliability.

BASiC is a leading company in the SiC power devices. It develops SiC chips and power modules, and its many products that meet automotive standards and for industrial applications have been adopted in a various fields, including electric vehicles, solar power generation and storage systems.

This strategic partnership between the companies will strengthen the market competitiveness of both and enable the provision of innovative solutions.

Toshiba Electronic Devices & Storage will continue to meet the diverse needs of its customers and to contribute to mitigating global warming by developing reliable, higher performance products. The two companies will also consider various forms of cooperation and aim to grow and develop both businesses while supporting the realization of a sustainable society.

Signing Ceremony (Front Left) He Weiwei, General Manager, BASiC Semiconductor Co., Ltd.; (front right) Noriyasu Kurihara, Director, Vice President of Semiconductor Division, Toshiba Electronic Devices & Storage Corporation

Signing Ceremony
(Front Left) He Weiwei, General Manager, BASiC Semiconductor Co., Ltd.;
(front right) Noriyasu Kurihara, Director, Vice President of Semiconductor Division,
Toshiba Electronic Devices & Storage Corporation

 

Toshiba Electronic Devices & Storage’s sales subsidiary in China, Toshiba Devices & Storage (Shanghai) Co., Ltd., will jointly exhibit with BASiC and BASiC's affiliate, Bronze Technologies Ltd., at "PCIM Asia Shanghai 2025," which will be held in Shanghai from September 24 to 26, 2025.

About Toshiba Electronic Devices & Storage Corporation
Toshiba Electronic Devices & Storage, a wholly owned subsidiary of Toshiba Corporation, is responsible for the semiconductor business and storage products (HDD) business within Toshiba Group. Toshiba Group, with its long-standing Basic Commitment, “Committed to People, Committed to the Future.,” aims to advance the achievement of carbon neutrality and a circular economy. Toshiba Electronic Devices & Storage has for decades supplied power semiconductors, mainly for automotive and industrial markets, that have helped to secure energy saving solutions and equipment miniaturization. The company is expanding power semiconductor production capacity by using 300mm wafers. It is also advancing development of a wider lineup of SiC power devices, especially for automotive and power transmission and distribution applications, taking full advantage of the expertise it has cultivated in railway vehicle applications.
https://toshiba.semicon-storage.com/ap-en/top.html

About BASiC Semiconductor Co., Ltd.
BASiC Semiconductor Co., Ltd., the innovative enterprise of Wide-Band-Gap semiconductor industry in China, is committed to the R&D and industrialization of SiC power devices. BASiC masters the state-of-the-art SiC semiconductor technologies. Its R&D cover the whole industrial chain of SiC power devices, including as chip design, wafer fabrication, packaging and driver circuits. BASiC launched series of product such as discrete SiC Schottky Diodes & MOSFETs, Automotive & Industrial SiC Power Modules and Power Device Driver ICs. The products are widely used in renewable power generation, electric vehicles, locomotive traction, industrial drives and smart grids.
https://www.basicsemi.com/en/

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