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Automotive Interface Bridge ICs

As in-vehicle infotainment (IVI) systems, along with other automotive systems, become more sophisticated, requiring greater functionality and higher performance, an interface gap problem between peripheral devices and Systems-on-chip (SoCs) easily arises. Toshiba interface bridge ICs can help to solve this problem.

Automotive Peripheral Bridge IC

SoCs, widely applied in smartphones and tablets, are increasinly appearing in automotive applications as IVI systems become more sophisticated, requiring greater functionality and higher performance. But because connectivity standards differ among devices such as displays, existing SoCs often lack the interfaces required for automotive networks.

Automotive Peripheral Bridge ICs

Necessity of AMPD (Interface Bridge IC)

SoC with only MIPI I/Fs as AV I/F may require AMPDs to connect external devices such as displays and cameras.

Necessity of AMPD (Interface Bridge IC)

Toshiba’s new range of video interface bridge devices provide HDMI to MIPI® CSI-2 (TC9590), MIPI® CSI-2 to/from parallel (TC9591), and MIPI® DSI to LVDS (TC9592/3) connectivity. The devices are offered in 0.65mm pitch, VFBGA packages between 5 x 5 mm and 7 x 7mm, with the exception of the TC9590 which is housed in an LFBGA64, 0.8mm pitch 7 x 7mm package.

Toshiba has a long track record of developing MIPI®-based interface bridge chips for consumer applications and has drawn on this experience in developing the new automotive IVI range.

Sample shipments of the new devices start in June 2018.

For Automotive TC9591 TC9590 TC9592 TC9593 TC959x
For Consumer TC358748I TC358743I TC358774 TC358775 TC358867
  • MIPI CSI2 RX 4Lanes x 1ch
  • Parallel input 24bit@154MHz
4 Lanes x 1ch
4 Lanes x 1ch
4 Lanes x 1ch./ MIPI DPI (24bit)
  • Parallel output 24bit@100MHz
    4Lanes x 1ch

MIPI CSI2-TX 4Data LanesX1ch

Single Link 
(5 pairs/ link)

Dual Link
(5 pairs/ link)
Display Port
x 2 Ports/
MIPI DPI (24bit)
Resolution - - UXGA 1600x1200
WUXGA 1920x1200
Ta -40 to 105℃ -40 to 85℃ -40 to 85℃ -40 to 85℃ -20 to 85℃
7mm x 7mm
0.65mm pitch
7mm x 7mm 0.8mm pitch
5mm x 5mm 0.65mm pitch
6mm x 6mm 0.65mm pitch
7mm x 7mm
0.65mm pitch

*HDMI and the HDMI logo are trademarks or registered trademarks of HDMI Licensing in the U.S and other countries.

*MIPI® mark and logo are registered trademark of MIPI® Alliance, Inc.

TC9560XBG / TC9560AXBG [Under Development] / TC9560BXBG [Under Development]

Ethernet AVB Bridge solution for automotive applications.

Network interface for In-Vehicle Infotainment system (IVI) , Telematics and other automotive subsystem.

  1. The TC9560 Family supports standards such as IEEE 802.1AS and IEEE 802.1Qav generally referred to as Ethernet-AVB.
    Connected to an application processor or other SoC host, the TC9560XBG allows the host device to deliver audio, video, and data through the 10/100/1000 Ethernet network in an automotive environment.
  2. The connection to the host is via PCIe® running at 2.5/5.0 GT/s (PCIe Gen1.0/2.0), 480 Mbps HSIC or TDM (Time Division Multiplex)/I2S for audio traffic.
  3. Provides an Ethernet PHY interface selectable from RGMII, RMII and MII.
  4. The design target is to achieve a low-power mode that typically consumes 1 mW at room temperature (measured by Toshiba). The TC9560XBG typically takes only 100 ms to return to normal operation (measured by Toshiba) in order to meet the market need. TheTC9560XBG is scheduled to obtain AEC-Q100 Grade 3 qualification.
System Block Diagram
  • Example


  • Interfacing Example


TC9560 Family Part Number TC9560XBG TC9560AXBG** TC9560BXBG**
Package PLFBGA170 (0.65)
Applications Ethernet AVB Bridge Solution For Automotive Applications
Host (External application) I/F: -
  • PCIe I/F [Gen2.0 (5 GT/s), Gen1.0 (2.5 GT/s), Endpoint, Single lane]
  • HSIC I/F (480 Mbps)
- -
Automotive I/F:
  • Ethernet AVB [IEEE802.1AS, IEEE 802.1Qav].
    The interface is selectable from RGMII, RMII and MII, MAC
  • CAN-FD (2 ch)
- -
Audio I/F: I2S/TDM
Peripheral I/F: I2C/SPI, Quad-SPI, UART, GPIO, INTC
CPU Core: Arm®Cortex®-M3
Supply Voltage (V) 1.8/3.3 for IO, 1.2 for HSIC, 1.2/2.5/3.3 for RGMII/RMII/MII, 1.1 for Core

**: Under development

* Arm and Cortex are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere.

* PCI Express and PCIe are registered trademarks of PCI-SIG.

* System and product names mentioned herein may be trademarks or registered trademarks of respective companies or organizations.


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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.