Toshiba brings power, storage and battery technologies to electronica 2026

Toshiba Electronics Europe GmbH (“TEE”) will present its “Excellence in Power” portfolio at electronica 2026 in Munich from 10 to 13 November. Visitors to Hall C3, Stand C3.119 can explore semiconductor, storage and battery technologies for efficient power conversion, scalable data storage and resilient energy supply.

The stand will bring together Toshiba’s semiconductor, storage and battery divisions across four areas: AI/Data Centre, Automotive, Energy/Infrastructure, and Physical AI. Engineers can examine reference designs, demonstrations and device exhibits, and discuss their current design priorities and future platform requirements with Toshiba’s technical and management teams.

For AI and data-centre designers, the exhibits will address data storage, energy buffering, and power delivery. Toshiba’s MG Series enterprise hard disk drives come in a range of capacities designed to support 24/7 mixed use workloads and illustrate the role of high-capacity storage in AI data lakes, backup and archives. Alongside these, SCiB™ lithium-ion battery cells and modules will introduce technology suited to rapid charging and frequent cycling. Visitors can discover its use in backup power, peak-load management and energy buffering.  Semiconductor power-supply reference designs include a 3 kW design using surface-mounted silicon carbide (SiC) MOSFETs and a 1.6 kW resonant AC–DC converter for servers. These provide starting points for engineers working to reduce conversion losses and manage heat in demanding power-supply applications.

Automotive demonstrations will include water-pump and fan control using SmartMCD™ motor-control devices and low-voltage MOSFETs, addressing thermal management in electric and passenger vehicles. A 3 kW, 48 V–12 V DC–DC converter reference model will also be on display, together with traction semiconductor devices and packaging exhibits.

For energy infrastructure and industrial power conversion, Toshiba will show SiC power modules and gate-drive reference designs, alongside train traction inverter solutions. Packaging exhibits will address thermal management and compact system design. High-power, high-voltage devices, and SCiB™ lithium-ion batteries will extend the discussion to grid applications, and peak shaving.

Toshiba will also present solutions for physical AI featuring motor control, connectivity and sensing.

Visitors can meet Toshiba specialists in Hall C3, Stand C3.119 throughout the show. To arrange a meeting and request a complimentary electronica entrance ticket, they should contact their Toshiba representative.